Rugged
Contact Systems

Rugged Contact Systems
High-Reliability • High Mating Cycles • Design Flexibility

Tiger Eye, Samtec’s most rugged contact system rated to 1,000+ mating cycles, features multiple points of contact for high-reliability in board-to-board, discrete wire and IDC cable assemblies with a variety of ruggedizing options. Rugged Edge Rate® contacts are optimized for high speeds to 56 Gbps PAM4 and designed for increased wear life. Micro Mate™ discrete wire systems offer design flexibility for cable-to-cable, cable-to-board and panel-to-board applications.

Rugged Contact Systems Brochure

Rugged Contact Systems Brochure

Download PDF

Rugged Tiger Eye™ SystemsRugged Tiger Eye™ Systems

These rugged, high-reliability, high-cycle interconnects feature Samtec's Tiger Eye™ contact system.

Features
  • High-reliability Tiger Eye™ three-finger BeCu contact system
  • Optional locking and latching systems for higher withdrawal force
  • Extended Life Product™ testing available
  • Standard and cost-saving designs
Products
V
  • SEM
  • TEM
  • SEML
  • SEMS
  • TEMS
  • SFM
  • TFM
  • TFML
  • SFC
  • TFC
  • SFMH
  • FSH
  • SFMC
  • FOLC
  • MOLC
  • S2M
  • T2M
  • SMM
  • TMM
  • SFML
Rugged Tiger Eye™ Systems

1.00 mm Pitch Micro Mate™1.00 mm Pitch Micro Mate™ Discrete Wire System

Space saving discrete wire system that supports cable-to-board, cable-to-cable and cable-to-panel applications.

Features
  • One product family that supports cable-to-board, cable-to-cable and cable-to-panel applications
  • Extremely small form factor compared to other 28 AWG assemblies
  • Rugged single or double latching for a solid connection
  • Panel mount version fits .033" - .090" panel thickness
  • Crimp-style dual leaf contact system
  • 2 through 20 total contacts (single row)
  • 4 through 40 total contacts (double row)
  • 28 or 30 AWG wire
  • Teflon® wire available for high temp or halogen free applications
  • Extremely low profile, right-angle board mount connector/cable mate
  • Available as components or complete assemblies
  • Assembly tooling available
Products
V
  • S1SS
  • S1SST
  • S1SD
  • S1SDT
  • T1M
  • T1SS
  • T1SST
  • T1SD
  • T1SDT
  • T1PS
  • T1PST
  • T1PD
  • T1PDT
  • ISS1
  • ISD1
  • CC09R
  • CC09M
  • IST1
  • ISP1
  • IDT1
  • IDP1
  • TC37M
  • TC37R
1.00 mm Pitch Micro Mate™
features

Edge Rate®Edge Rate® Connector Strips

Rugged Edge Rate® contact systems optimized for signal integrity performance.

Features
  • Edge Rate® contacts optimized for signal integrity performance
  • 1.5 mm contact wipe
  • Robust when "zippered" during unmating
  • Up to 56 Gbps PAM4 performance
  • 0.50 mm, 0.635 mm or 0.80 mm pitch systems
  • Stack heights from 5 mm to 18 mm
  • Extremely slim 2.5 mm body width on 0.635 mm pitch system
  • 0.50 mm pitch system for up to 40% PCB space savings vs 0.80 mm pitch system
Products
V
  • ERM8
  • ERF8
  • ERM8-RA
  • ERF8-RA
  • ERM8-EM
  • ERF8-EM
  • ERM8-S
  • ERF8-S
  • ERM5
  • ERF5
  • ERF5-RA
  • ERM6
  • ERF6
Edge Rate®


Since we rolled out the new Profile Management system a couple of months ago, we’ve been steadily adding features. Here are some of the newest features that have been added to simplify your life across Samtec.com. Add all types of addresses When adding or editing a new address, y...
In our recent series of articles about connectors for the medical industry, we have looked at some of the equipment that is used in hospitals. While much of our focus has been on the devices that are used in surgery and the care of patients, there is a significant portion of the ...
This video, from the AI Hardware Summit, shows a prototypical Gen-Z PECFF demonstration based on PCIe 6.0, at 64 GT/s. It shows PCB connectors and twinax cable systems, with performance capabilities eminently suitable for AI hardware applications. It’s a Gen-Z backplane with Gen-...
It has been many years since Samtec set up a booth at the AUSA annual meeting. That may have to change just for the sheer fact of the customers and technology that was displayed. The Association of the United States Army (AUSA) is a nonprofit educational and professional developm...
Designers are well-aware that as data rate requirements approach and surpass 112 Gbps PAM4, they face challenges of balancing increasing throughput, scalability and density demands with concerns such as power consumption, signal integrity, cost and time-to-market, to name a few. ...