triangle alert This site uses cookies and other website monitoring technologies to assist with website functions and with our promotional and marketing efforts. By clicking Accept, you consent to the terms in our recently updated Privacy Notice and Policy Manual.
Accept Decline
triangle alert This site uses cookies and other website monitoring technologies to assist with website functions and with our promotional and marketing efforts. By clicking Accept, you consent to the terms in our recently updated Privacy Notice and Policy Manual.
Accept Decline

LP Array™ SI Evaluation Kit

SI test platform for evaluating LP Array™ Low Profile Open-Pin-Field Arrays


Overview

Samtec LP Array™ Low Profile Open-Pin-Field Arrays support high-speed, high density applications with maximum routing and grounding flexibility. The LP Array™ SI Evaluation Kit provides system designers and SI engineers an easy-to-use solution for testing LP Array™ connectors.

The LP Array™ SI Evaluation Kit delivers a high-quality system with robust mechanical design. It can be used standalone for LP Array™ connectors. Please contact Samtec’s technical experts at KitsAndBoards@samtec.com for additional information.

lp array ref200470
Samtec Part No. REF-200470-X.XX-X.XX-01 Pictured

Features

  • Two PCB system with compact form factor
  • One PCB contains LPAM series connector (LPAM-40-XX-X-L-08-2-K-TR)
  • Second PCB contains LPAF series connector (LPAF-40-XX.X-L-08-2-K-TR)
  • Supports multiple LPAM/LPAF stack heights (4 mm/4.5 mm/5 mm)
  • Routes high-speed differential pairs (20 total) from LPAM/LPAF connectors to high-precision RF connectors
  • Supports multiple high-precision RF connector options (2.40 mm/2.92 mm SMAs)
  • Optimized SI performance via Samtec Final Inch® BOR PCB trace routing
  • Enable time domain measurements via direct connection to TDR/TDTs
  • Enable frequency domain measurements via direct connection to VNAs

Applications

  • FPGA/SoC Development Boards
  • Servers
  • Storage
  • Networking
  • Test and measurement
  • Wired communication
  • Wireless communications

Ordering Information

Please see drawing REF-200470-X.XX-X.XX-01 for more detail.

CONTACT SALES

First Name
Last Name
Email
Company
Industry
Estimate Annual Usage
Family
Message

Don't want to fill out a form?
Chat with a product expert directly.

.
.
In November, we wrapped up our technical debt cleanup, upgraded several of our back-end APIs, and rolled out several small user-experience updates throughout Samtec.com. These updates will pave the way for some exciting new applications and e-e-commerce features in 2020. Here are...
In the video above Ralph Page, Systems Architect at Samtec, walks us through a live product demonstration that received a lot of attention at Super Computing 2019. Ralph discusses several Samtec 56 Gbps PAM4 connector solutions and shares some incredible results. The system can a...
Sam Shine, the founder of Samtec, passed away on November 15 at age 86. Since his passing, several articles and obituaries have been written about Sam and his legacy. Rightfully so, most focus on his love for the Southern Indiana community, his local and national conservation eff...
The global XDF technology road shows come to Beijing next week. FPGA designers, system architects, data scientists and other technical leaders will gather December 3-4, 2019 at the China National Convention Center. Samtec technical experts and our partners will demonstrate some o...
FireFly™, ExaMAX® and Bulls Eye®, oh my! So, obviously, that is one geek’s riff on a popular song in The Wizard of Oz. Dorothy, Scarecrow and Tinman were anxious for what came next on their walk down the Yellow Brick Road. Similarly, Samtec engineering customers are also anxious ...