LP Array™ SI Evaluation Kit

SI test platform for evaluating LP Array™ Low Profile Open-Pin-Field Arrays


Overview

Samtec LP Array™ Low Profile Open-Pin-Field Arrays support high-speed, high density applications with maximum routing and grounding flexibility. The LP Array™ SI Evaluation Kit provides system designers and SI engineers an easy-to-use solution for testing LP Array™ connectors.

The LP Array™ SI Evaluation Kit delivers a high-quality system with robust mechanical design. It can be used standalone for LP Array™ connectors. Please contact Samtec’s technical experts at KitsAndBoards@samtec.com for additional information.

lp array ref200470
Samtec Part No. REF-200470-X.XX-X.XX-01 Pictured

Features

  • Two PCB system with compact form factor
  • One PCB contains LPAM series connector (LPAM-40-XX-X-L-08-2-K-TR)
  • Second PCB contains LPAF series connector (LPAF-40-XX.X-L-08-2-K-TR)
  • Supports multiple LPAM/LPAF stack heights (4 mm/4.5 mm/5 mm)
  • Routes high-speed differential pairs (20 total) from LPAM/LPAF connectors to high-precision RF connectors
  • Supports multiple high-precision RF connector options (2.40 mm/2.92 mm SMAs)
  • Optimized SI performance via Samtec Final Inch® BOR PCB trace routing
  • Enable time domain measurements via direct connection to TDR/TDTs
  • Enable frequency domain measurements via direct connection to VNAs

Applications

  • FPGA/SoC Development Boards
  • Servers
  • Storage
  • Networking
  • Test and measurement
  • Wired communication
  • Wireless communications

Ordering Information

Please see drawing REF-200470-X.XX-X.XX-01 for more detail.

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