High-Density Edge Card

High-speed, high-density edge card system with bi-level mating.

FEATURES

  • Staggered contacts for effective 0.50 mm pitch
  • Bi-level mating (2 mating stages)
  • 4 rows of contacts
  • Saves PCB real estate
  • Accepts 1.60 mm (.062") and 2.36 mm (.093") thick cards
  • 80 - 140 I/Os

SERIES

BEC5C

0.50 mm Low Cost High-Density High-Speed Edge Card

Features
  • Staggered contacts for effective 0.50 mm (.0197") pitch
  • Accepts .062" (1.60 mm) and .093" (2.36 mm) thick cards
  • Low cost phosphor bronze contact system
  • Lead-free solder crimp termination for easy board processing
  • Standard weld tabs and alignment pins
0.50 mm Low Cost High-Density High-Speed Edge Card

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