SUPERNOVA™ Low Profile Compression Interposers

High-speed, low profile one-piece interposers with a 1.27 mm body height and dual compression contacts.

FEATURES

  • 1.27 mm standard body height
  • 1.00 mm pitch
  • Dual compression contacts
  • 100 – 300 total pins
  • Ideal for low cost board stacking, module-to-board and LGA interfaces
  • Minimizes thermal expansion issues
  • Analog Over Array™ capable

VIDEOS

Samtec Advanced Interconnect Design Tech Center

Products

GMI

1.00 mm SUPERNOVA™ Low Profile Compression Interposer

Features
  • Dual compression contacts
  • Up to 300 I/Os
  • Low profile - 1.27 mm standard height
  • Analog Over Array™ capable
1.00 mm SUPERNOVA™ Low Profile Compression Interposer

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