Low Profile Compression Interposers

High-speed, low profile one-piece interposers with a 1.27 mm body height and dual compression contacts.

FEATURES

  • 1.27 mm standard body height
  • 1.00 mm pitch
  • Dual compression contacts
  • 100 – 300 total pins
  • Ideal for low cost board stacking, module-to-board and LGA interfaces
  • Minimizes thermal expansion issues

VIDEOS

Samtec Advanced Interconnect Design Tech Center

Products

GMI

1.00 mm Low Profile Compression Interposer

Features
  • Dual compression contacts
  • Up to 300 I/Os
  • Low profile - 1.27 mm standard height
1.00 mm Low Profile Compression Interposer

CONTACT SALES

First Name
Last Name
Email
Company
Industry
Estimate Annual Usage
Family
Message

Don't want to fill out a form?
Chat with a product expert directly.

.

More Compression Interposers

Cutting-edge data rates have received much well-deserved press in the electronics media. New 56 and 112 Gbps PAM4 systems are in operation with verified, sustainable performance, and we’re on the […] The post Integral Ground Plane For Data Rate, Power, and Processing appeared fir...
A live product demonstration from DesignCon 2023 highlights the outstanding PCIe 6.0 performance of both a Samtec Flyover® high-speed cable assembly and a Rohde & Schwarz® ZNA vector network analyzer. […] The post Rohde & Schwarz VNA Verifies Excellent PCIe 6.0 Performance Of Hig...
One of the ways we continue to hold the #1 spot for several website categories in our industry is by making it easy for customers to get in touch with us and […] The post Try This Helpful New Way to Submit Website Feedback appeared first on The Samtec Blog....
In this live demonstration from DesignCon 2023, the performance of a Samtec high-speed cable system is measured by the world’s first scalable VNA. Matt Burns (Technical Marketing Manager, Samtec), and […] The post Cutting Edge High-Speed Cable Performance Measured By The World’s ...
A new connector system improves signal integrity by improving power integrity. Optimizing power integrity provides greater signal integrity margin and improves power and thermal efficiency.  The design of a high-speed […] The post Improve Power Integrity and Signal Integrity With...