Samtec Advanced Packaging Design & Support
Complete Design & Support for Advanced Packaging Applications
Development
Complete support is available from the early stages of the design process, including:
- Advanced IC Package Design
- Material Selection & Procurement
- Assembly Processing / Compatibility
- Package Reliability / Testing
Prototyping
To help get your design to market faster, we offer quick-turn prototyping, along with:
- Initial Concept Builds
- Reasonable NREs
- Industry-Leading Lead-Times
- Minimized Iterations Save Time-to-Market
Production
Full production capabilities support a variety of order volumes and cost-levels:
- High Yield Automation / Production
- Repeatability / Process Control
- Transfer Molding Capabilities
- Asian Subcontractors Provide Flexibility
CORE PACKAGING CAPABILITIES
PRECISION DIE PLACEMENT
High-speed, high accuracy die placement (to +/- 3 microns)
WIRE BONDING
Ultra-fine pitch, ultra-low profile ball bond, wedge bond or ribbon bond
FINE PITCH FLIP CHIP & JET UNDERFILL
Ultra-high bump count; tight keep-out regions between die
ENCAPSULATION
Encapsulating with dam and fill, glob top or transfer molding
ADVANCED PACKAGING DESIGN & ASSEMBLY
Advanced substrates, inspection & metrology
Glass substrate manufacturing, fan out technology
2.5D / 3D TxV technology
Wafer Dicing - 2" to 8" capabilities; thicknesses down to 25 μm
Solder Ball Attach for tight pitches down to 0.4 mm
Lid Attach - AuSn solder, glass frit, hermetic, fluidic, optical, custom materials
VIEW TYPICAL DESIGN GUIDELINES
COMPLEX WIRE BOND
FLIP CHIP & UNDERFILL
PRECISION DIE ATTACH
FINISHING CAPABILITIES
KEY ENABLING TECHNOLOGIES
Samtec is invested in the development of innovative products and technologies to meet the density and performance demands of next generation microelectronics. Some of our current technologies in development include:
- Thermocompression Bonding
- Gold Stud Bumping
- Anodic Bonding (Wafer-to-Wafer)
- Transfer Molding (Conventional and optically clear mold compounds)
- Silicon Photonics and Optics with Ultra-Tight Tolerances
IC PACKAGING & ASSEMBLY DESIGN GUIDELINES
NOTE
These dimensions are guidelines designed to help release product to manufacturing as quickly as possible. Full capabilities are not limited to the specifications listed below. Please contact SME@samtec.com for applications with tighter requirements.
PRECISION DIE ATTACH
Typical Die Attach Structure & Specifications
- Minimum distance between surrounding square of fiducial and neighboring objects must be 0.048 mm
- Gray level contrast between background and fiducial must be a minimum of 100 gray levels out of 256
- Background of fiducial must not have a structure and background must be single colored gray level
- Max. die size for dipping: 50 mm x 50 mm
- No waffle-pack handling for die < 1 mm2
- Maximum length to width ratio for components: 5:1
- Saw kerfs must be at least 25 μm and into the dicing tape (through the entire wafer thickness)
- Die attach materials can be non-conductive, conductive, die-attach-films (DAF) and solder preforms; other processes can be discussed per customer requirements
FINE PITCH WIRE BOND
Typical Structure & Specifications For Wiring & Substrate Pad Design
Plating and layout requirements for substrate pad design as well as wire parameters:
- Wedge Bond - ENIG plating is acceptable; typical wire types include Al, Au and Pt
- Ball Bond - ENEPIG plating is recommended; typical wire types include Au & Cu
Processes that use Au ball bond, require Gold plate per MIL-G–45204, Type III, Grade A, Class 1:
- 99.9% purity minimum
- < 90 Knoop hardness
- 50μ" thick, minimum
FLIP CHIP & UNDERFILL
Package Size:
- Min: 10 mm x 10 mm
- Max: 63 mm x 63 mm
Flux:
- No-clean fluxes
- Water-soluble fluxes
- RMA-based fluxes
Substrate BGA Solder Ball:
- Min Size: 0.018" dia
- Max Size: 0.025" dia
- Material: Eutectic Pb:Sn (37:63) or Pb-Freze
Substrate BGA Pad:
- Shortest BGA Ball Pitch: 0.80 mm x 0.80 mm
- Furthest Pitch: No constraint
- Pad Layout: Any configuration is acceptable
PACKAGE ENCAPSULATION
Typical Structure & Specifications For Package Encapsulation
- Maximum encapsulation thickness (board surface to top of encapsulation): 0.024" (600)
- Automated dispense tool heated work area: 12" x 16"
- Total work area: 20" x 30"
- Machine positioning accuracy and repeatability: +/- 0.001"
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