XCede® HD High-Density Backplane System
XCede® HD High-Density Backplane System
FAMILY OVERVIEW
XCede® HD combines a small form factor with incredible design flexibility for significant board and system space savings. The system’s modularity gives designers the opportunity to create a fully custom backplane solution with optional power modules, guidance & keying, and side walls for increased durability. Featuring a staggered differential pin design, the ground pins mate first for hot-plugging to help prevent system downtime.
Modular Design
XCede® HD consists of signal, power and keying/guidance modules for incredible design flexibility. The modules can be customized in any configuration to meet specific application requirements.
How to build a full solution:
- Right-angle modules can be built into a single customizable BSP part. Build a BSP part by combining any number, in any configuration, of HDTFs, power and keying/guidance modules to create one receptacle.
- Header modules mount to the backplane individually, in any configuration of HDTM and HPTS parts.
- Build Your Custom XCede® HD Solution
- Contact HSBP@samtec.com for more information about building a full XCede® HD solution.
FEATURES
- Up to 84 differential pairs per linear inch
- 1.80 mm column pitch
- 3-, 4- and 6-pair designs
- 4, 6 or 8 columns
- 12 - 48 pairs
- Up to a 3.00 mm contact wipe on signal pins
- Multiple signal/ground pin staging options
- Integrated power, guidance, keying and side wall options available
- 85 Ω and 100 Ω options
- Three levels of sequencing enable hot plugging
- Cost-effective designs available for low-speed applications
DOWNLOADS & RESOURCES
Literature
HDTF
XCede® HD 1.80 mm High-Density Backplane Right-Angle Receptacle
Features
- 3-, 4- and 6-pair designs
- 4, 6 or 8 columns
- Standard or high-speed wafers available
- 85 Ω and 100 Ω options
- Modular design provides flexibility in applications
HDTM
XCede® HD 1.80 mm High-Density Backplane Vertical Header
Features
- 3-, 4- and 6-pair designs
- 4, 6 or 8 columns
- Three levels of sequencing enable hot plugging
- Up to 3.00 mm contact wipe on signal pins
- Integrated guidance, keying and polarizing side walls available
BSP
XCede® HD High-Density Backplane Custom Right-Angle Module
Features
- Fully custom module to meet specific application requirements
- Combine any number, in any configuration of HDTF (signal), power and keying/guidance to create one BSP product
- Power and keying/guidance available for custom configurations only
- For a signal only solution, see HDTF Series
- Contact HSBP@samtec.com for assistance building a BSP product
HPTS
XCede® HD Power Module
Features
- Mounts individually to backplane
- Variety of body heights to match signal module pair count
- Press-fit tails
- Vertical Mount
More Power/Signal Systems
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