Systems engineered for maximum density + performance.
Targeted performance for return loss compliance in 85 Ω & 100 Ω systems
Future-proof design for easy migration to 56 Gbps systems
Unique contact geometry results in lowest mating force on the market
Single track routing on 2.00 mm pitch; single or double track on 3.00 mm pitch
Advanced support for full system + cost optimization.
PCB layout and trace routing strategies for optimized performance
Design assistance from consulting review to full turn-key design
PCB materials expertise for optimized cost and performance
Full system Signal / Power Integrity analysis and design
Comprehensive engineering approach + backplane expertise enables full system optimization.
Our comprehensive engineering approach integrates design, simulation, test and development services that help optimize high-speed backplane systems, including:
*ExaMAX® is a trademark of FCI.
Combining the electrical and mechanical benefits of the ExaMAX® interconnect system with the materials and routing expertise of Samtec Teraspeed Consulting has allowed Samtec to develop a high-speed backplane system concept that optimizes both cost and performance. The system:
The result is a reduction of approximately 25% the cost of a traditional backplane system.
|Low-loss PCB||FR-4 + Cables||Total Savings|
|SYSTEM COST||$1390 (1 backplane panel + connectors)||$1395 to $1091 (for various cable architectures)||0% to 21%|
A future-proof 28 Gbps performance design offers an easy migration path to 56 Gbps. With a choice of 28 Gbps performance on a 2.00 mm column pitch, or 56 Gbps performance on a 3.00 mm col umn pitch, designers have the option of optimizing density or minimizing board layer count for high-speed backplane applications.
|Column Pitch||Performance||Impedance||Contact Wipe||I/Os||Mating / Unmating Force (per contact)||Normal Force|
(2.00 mm pitch)
(3.00 mm pitch)
(addresses 85 Ω & 100 Ω applications)
mating surface area
|72 pair design
(6 pair x 12 column)
40 pair design
(4 pair x 10 column)
|0.36 N maximum
0.12 N minimum
(end of life)
For additional information visit samtec.com/searay.
Up to 8 pair per column, 3.00 mm pitch
High-density 56 Gbps (NRZ) Backplane System
High-density 112 Gbps (PAM4) backplane system
Eliminates mid-plane, decreases cost and layer counts
Power modules, alignment hardware, advanced mating
Backplane cable solutions designed to reduce board layers and costs
Right-angle and vertical arrays with 2.00 mm extended contact wipe
Right-angle array with integrated optics to support VITA 74