High-Speed Backplane System Optimization

By evaluating cost and performance, along with how components operate in the context of the complete high-speed backplane system, Samtec is able to develop products and strategies that help optimize the entire backplane system.

ADVANCED INTERCONNECT DESIGN

Systems engineered for maximum density + performance.

Targeted performance for return loss compliance in 85 Ω & 100 Ω systems

Targeted performance for return loss compliance in 85 Ω & 100 Ω systems

Future-proof design for easy migration to 56 Gbps systems

Future-proof design for easy migration to 56 Gbps systems

Unique contact geometry results in lowest mating force on the market

Unique contact geometry results in lowest mating force on the market

Single track routing on 2.00 mm pitch; single or double track on 3.00 mm pitch

Single track routing on 2.00 mm pitch; single or double track on 3.00 mm pitch

Samtec Teraspeed Consulting

Advanced support for full system + cost optimization.

PCB layout and trace routing strategies for optimized performance

PCB layout and trace routing strategies for optimized performance

Design assistance from consulting review to full turn-key design

Design assistance from consulting review to full turn-key design

PCB materials expertise for optimized cost and performance

PCB materials expertise for optimized cost and performance

Full system Signal / Power Integrity analysis and design

Full system Signal / Power Integrity analysis and design

PRACTICAL APPLICATIONS

Comprehensive engineering approach + backplane expertise enables full system optimization.

The expertise of Samtec’s Technology Centers enables high-speed backplane systems optimized for both the performance and cost of the entire backplane system.

  • Extensive backplane and platform R&D experience, including design, layout, PCB materials and high-speed interconnects
  • Assistance ranging from consulting review to full turn-key design

Our comprehensive engineering approach integrates design, simulation, test and development services that help optimize high-speed backplane systems, including:

  • Modeling, simulation and measurement methodology development
  • Advanced signal and power integrity engineering
  • Full channel analysis, optimization and design
  • High bandwidth full-wave S-Parameter model extraction along the entire signal chain

*ExaMAX® is a trademark of FCI.

Samtec Teraspeed Consulting
Samtec Teraspeed Consulting demonstration of a 28 Gbps backplane system attaching two Xilinx VCU109 Evaluation Boards across Samtec’s ExaMAX® backplane connectors. The demo leveraged advanced design optimization techniques that minimize insertion loss, return loss and crosstalk, while utilizing advanced PCB materials. Photo courtesy of Xilinx.

COST-SAVING HIGH-PERFORMANCE CABLE BACKPLANE SYSTEM

Samtec Optical Group and Samtec Teraspeed Consulting
25 Gbps cable backplane system offers significant cost savings while achieving higher bandwidths.

Combining the electrical and mechanical benefits of the ExaMAX® interconnect system with the materials and routing expertise of Samtec Teraspeed Consulting has allowed Samtec to develop a high-speed backplane system concept that optimizes both cost and performance. The system:

  • Fully leverages cost-effective, traditional PCB materials
  • Simplifies PCB layout and reduces layer count
  • Provides for expanded bandwidths with use of cable vs. PCB routing

The result is a reduction of approximately 25% the cost of a traditional backplane system.

25 Gbps CABLE BACKPLANE SYSTEM OPTIMIZATION
(16 Slot Backplane with Fourteen (14) 400 G Redundant Cables)
Low-loss PCB FR-4 + Cables Total Savings
SYSTEM COST $1390 (1 backplane panel + connectors) $1395 to $1091 (for various cable architectures) 0% to 21%

HIGH-SPEED BACKPLANE & MICRO BACKPLANE

ExaMAX® HIGH-SPEED BACKPLANE SYSTEMS

A future-proof 28 Gbps performance design offers an easy migration path to 56 Gbps. With a choice of 28 Gbps performance on a 2.00 mm column pitch, or 56 Gbps performance on a 3.00 mm col umn pitch, designers have the option of optimizing density or minimizing board layer count for high-speed backplane applications.

  • 28 Gbps performance on 2.00 mm column pitch
  • 56 Gbps performance on 3.00 mm column pitch (in design)
  • Engineered for 92 Ω impedance; addresses both 85 Ω and 100 Ω applications
  • Exceeds OIF CEI-28G-LR specification for 25 Gbps standards
  • Contact system achieves two reliable points of contact, even when subjected to angled mating
  • 2.40 mm contact wipe
  • Individual signal wafers with staggered, differential pairs
  • One-piece, embossed ground structure reduces crosstalk
  • Lowest mating force on the market: 0.36 N max per contact
  • Stub free mating
  • Press-fit termination
ExaMAX® High-Speed Backplane Systems
ExaMAX® High-Speed Backplane Systems
Column Pitch Performance Impedance Contact Wipe I/Os Mating / Unmating Force (per contact) Normal Force
2.00 mm
3.00 mm
(in development)
28 Gbps
(2.00 mm pitch)
56 Gbps
(3.00 mm pitch)
92 Ω
(addresses 85 Ω & 100 Ω applications)
2.40+ mm
mating surface area
72 pair design
(6 pair x 12 column)
40 pair design
(4 pair x 10 column)
0.36 N maximum
0.12 N minimum
30 g
(end of life)

HIGH-DENSITY MICRO BACKPLANE SYSTEMS

  • .050" (1.27 mm) pitch grid for maximum routing flexibility
  • Up to 500 single-ended I/Os or 125 differential pairs
  • Ultra high-density 0.80 mm pitch uses 50% less board real estate than standard SEARAY™ 1.27 mm pitch array
  • Right-angle arrays optimized for reduced skew and impedance mismatch
  • Lower insertion/extraction forces versus typical array products
  • Performance up to 36 Gbps
  • Up to 500 I/Os in open-pin-field design
  • Vertical, right-angle, press-fit
  • VITA 47, VITA 57, VITA 57.4
  • Solder on each tail for ease of processing
  • Rugged Edge Rate® contact system can be “zippered” during unmating

For additional information visit samtec.com/searay.

High-Density Micro Backplane System

TECHNOLOGY ROADMAP MID-BOARD + PANEL OPTICS

ExaMAX® 56 Gbps

Up to 8 pair per column, 3.00 mm pitch

High-Density 56 Gbps

High-density 56 Gbps (NRZ) Backplane System

High-Density (PAM4) 112 Gbps

High-density 112 Gbps (PAM4) backplane system

Direct mate orthogonal

Eliminates mid-plane, decreases cost and layer counts

ExaMAX® Add-on Features

Power modules, alignment hardware, advanced mating

Cable Backplane System

Backplane cable solutions designed to reduce board layers and costs

Searay™ Extended Wipe

Right-angle and vertical arrays with 2.00 mm extended contact wipe

Searay™ Optical Solutions

Right-angle array with integrated optics to support VITA 74

Samtec is expanding its line of ExaMAX® high speed backplane connectors. The new system is a direct mate orthogonal (DMO) configuration. These products were recently on display at SC17 in Denver. In the video above, Jonathan Sprigler, Samtec’s Backplane Product Manager, tells us ...
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