HIGH-SPEED backplane FOR NEXT GEN SPEEDS

Samtec helps address the challenges of next generation data rate requirements with industry-leading interconnect expertise, along with full system optimization support, including a vast library of development platforms and characterization kits for high-performance interconnect systems. Our high-performance ExaMAX® Backplane Systems are engineered to achieve up to 56 Gbps performance and include connectors and cable assemblies that provide the option to optimize density or minimize board layer count.

Overview

ExaMAX® Traditional Connectors

Enabling 56 Gbps electrical performance, ExaMAX® Vertical Headers & Right-Angle Receptacles meet industry specifications including PCI Express® and Ethernet, and feature a reliable two-point contact system on 2.00 mm pitch. Guide / power modules also available.

ExaMAX® Direct Mate Orthogonal

ExaMAX® Direct-Mate Orthogonal Headers and Right-Angle Receptacles on 2.00 mm pitch eliminate the need for a backplane / midplane, decreasing the number of connectors needed, while improving airflow and shortening the signal path for enhanced signal integrity.

ExaMAX® Backplane Cables

The ExaMAX® High-Speed Backplane Cable System leverages Samtec’s Eye Speed® Ultra Low Skew Twinax Cable technology for improved signal integrity, increased flexibility and routability. The system is highly customizable and helps reduce cost with lower layer counts.

DEVELOPMENT PLATFORMS

Xilinx® Virtex® UltraScale FPGA VCU110 Development Kit

  • The combination of the VCU110 Development Board and the ExaMAX® Loopback Card provides a platform for demonstrating 28 Gbps performance from an FPGA over Samtec’s ExaMAX® backplane connector system
  • Eight 28 Gbps GTY MGTs are routed from the FPGA through the ExaMAX® mated connector pair, back to the FPGA
  • The kit demonstrates optimized Signal Integrity performance via Samtec’s Final Inch® BOR PCB trace routing for the EBTM Series connector
  • ExaMAX® equipped channels meet the IEEE 802.3bj mandated loss performance of 25 db
  • Optimized SI performance via Samtec’s Final Inch® BOR PCB trace routing
  • Visit samtec.com/standards/fpgavcu110 for additional details

SI Characterization Kits

Samtec Signal Integrity Characterization Kits help simplify the design process and reduce time to market. Kits are available for many of our high-performance connector sets and standard high-speed cable assembly configurations. Custom kits are also available.

View details at samtec.com/kits or contact kitsandboards@samtec.com for the current list of available kits.


Families

ExaMAX®ExaMAX® High-Speed Backplane System

ExaMAX® high-speed backplane interconnects deliver 56 Gbps electrical performance.

Features
  • Enables 56 Gbps electrical performance on 2.00 mm column pitch
  • Allows designers to optimize density or minimize board layer count
  • Two reliable points of contact, even when subjected to angled mating
  • Meets Telcordia GR-1217 CORE specification
  • Individual signal wafers with staggered differential pair design; 72 or 40 pairs
  • One-piece embossed ground structure on each signal wafer to reduce crosstalk
  • Lowest mating force on the market: 0.36 N max per contact
  • Backplane cable assemblies improve signal integrity and increase signal path length at higher data rates
  • Samtec’s Eye Speed® ultra low skew twinax cable provides increased flexibility and routability
  • Stub free mating
  • Press fit termination
  • Power and Guide Modules available
Series
V
  • EBTM
  • EBTM-RA
  • EBTF-RA
  • EBDM-RA
  • EBCM
  • EBCF
  • EGBM
  • EGBF
  • EPTT
  • EPTS
  • EBCL
  • EBCB
ExaMAX®

XCede® HDXCede® HD High-Density Backplane System

Small form factor high-density backplane system ideal for density-critical applications, with a modular design and optional features for flexibility and customizable solutions.

Features
  • Small form factor provides significant space savings
  • Modular design provides flexibility in applications
  • High-performance system
  • High-density backplane system – up to 84 differential pairs per linear inch
  • 1.80 mm column pitch
  • 3-, 4- and 6-pair designs
  • 4, 6 or 8 columns
  • 12 - 48 pairs
  • Multiple signal/ground pin staging options
  • Integrated power, guidance, keying and side walls available
  • 85 Ω and 100 Ω options
  • Three levels of sequencing enable hot plugging
  • Cost-effective designs available for low-speed applications
Series
V
  • HDTF
  • HDTM
  • BSP
  • HPTS
XCede® HD

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