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triangle alert Our manufacturing capacity has been influenced by this pandemic, but our global operations team has been working tirelessly to maximize our output and minimize the impact to all our customers while prioritizing COVID-19 critical response applications. Some part numbers are experiencing delays, but many are not. You can access real-time lead times online within your account, chat, or call us anytime for the latest information. ×

XCede® HD High-Density Backplane System

XCede® HD High-Density Backplane System

Small form factor high-density backplane system ideal for density-critical applications, with a modular design and optional features for flexibility and customizable solutions.


FAMILY OVERVIEW

xcede hd

XCede® HD combines a small form factor with incredible design flexibility for significant board and system space savings. The system’s modularity gives designers the opportunity to create a fully custom backplane solution with optional power modules, guidance & keying, and side walls for increased durability. Featuring a staggered differential pin design, the ground pins mate first for hot-plugging to help prevent system downtime.

Modular Design

XCede® HD consists of signal, power and keying/guidance modules for incredible design flexibility. The modules can be customized in any configuration to meet specific application requirements.

How to build a full solution:

  • Right-angle modules can be built into a single customizable BSP part. Build a BSP part by combining any number, in any configuration, of HDTFs, power and keying/guidance modules to create one receptacle.
  • Header modules mount to the backplane individually, in any configuration of HDTM and HPTS parts.
  • Build Your Custom XCede® HD Solution
  • Contact HSBP@samtec.com for more information about building a full XCede® HD solution.
xcede assembly

FEATURES

  • Up to 84 differential pairs per linear inch
  • 1.80 mm column pitch
  • 3-, 4- and 6-pair designs
  • 4, 6 or 8 columns
  • 12 - 48 pairs
  • Up to a 3.00 mm contact wipe on signal pins
  • Multiple signal/ground pin staging options
  • Integrated power, guidance, keying and side wall options available
  • 85 Ω and 100 Ω options
  • Three levels of sequencing enable hot plugging
  • Cost-effective designs available for low-speed applications
xcede power guide

DOWNLOADS

Literature

High-Speed Board-to-Board Application Guide

High-Speed Board-to-Board Application Guide

Get
Broadcast Video Solutions Guide

Broadcast Video Solutions Guide

Get

SERIES

HDTF

XCede® HD 1.80 mm Right-Angle Backplane Receptacle

Features
  • 3-, 4- and 6-pair designs
  • 4, 6 or 8 columns
  • Standard or high-speed wafers available
  • 85 Ω and 100 Ω options
  • Modular design provides flexibility in applications
XCede® HD 1.80 mm Right-Angle Backplane Receptacle

HDTM

XCede® HD 1.80 mm Vertical Backplane Header

Features
  • 3-, 4- and 6-pair designs
  • 4, 6 or 8 columns
  • Three levels of sequencing enable hot plugging
  • Up to 3.00 mm contact wipe on signal pins
  • Integrated guidance, keying and polarizing side walls available
XCede® HD 1.80 mm Vertical Backplane Header

BSP

XCede® HD Custom Right-Angle Module

Features
  • Fully custom module to meet specific application requirements
  • Combine any number, in any configuration of HDTF (signal), power and keying/guidance to create one BSP product
  • Power and keying/guidance available for custom configurations only
  • For a signal only solution, see HDTF Series
  • Contact HSBP@samtec.com for assistance building a BSP product
XCede® HD Custom Right-Angle Module

HPTS

3.20 mm XCede® HD Power Module

Features
  • Mounts individually to backplane
  • Variety of body heights to match signal module pair count
  • Press-fit tails
  • Vertical Mount
3.20 mm XCede® HD Power Module

More High-Speed Backplane Systems

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