XCede® HD High-Performance, High-Density Backplane Connector System

Small form factor high-density backplane system ideal for density-critical applications, with a modular design and optional features for flexibility and customizable solutions.

FEATURES

  • Small form factor provides significant space savings
  • Modular design provides flexibility in applications
  • High-performance system
  • High-density backplane system – up to 84 differential pairs per linear inch
  • 1.80 mm column pitch
  • 3-, 4- and 6-pair designs
  • 4, 6 or 8 columns
  • 12 - 48 pairs
  • Multiple signal/ground pin staging options
  • Integrated power, guidance, keying and side walls available
  • 85 Ω and 100 Ω options
  • Three levels of sequencing enable hot plugging
  • Cost-effective designs available for low-speed applications

SERIES

HDTF

XCede® HD 1.80 mm Right-Angle Backplane Receptacle

Features
  • 3-, 4- and 6-pair designs
  • 4, 6 or 8 columns
  • Standard or high-speed wafers available
  • 85 Ω and 100 Ω options
  • Modular design provides flexibility in applications
XCede® HD 1.80 mm Right-Angle Backplane Receptacle

HDTM

XCede® HD 1.80 mm Vertical Backplane Header

Features
  • 3-, 4- and 6-pair designs
  • 4, 6 or 8 columns
  • Three levels of sequencing enable hot plugging
  • 4.00 mm contact wipe
  • Integrated guidance, keying and polarizing side walls available
XCede® HD 1.80 mm Vertical Backplane Header

HPTS

3.20 mm XCede® HD Power Module

Features
  • Mounts individually to backplane
  • Variety of body heights to match signal module pair count
  • Press-fit tails
  • Vertical Mount
3.20 mm XCede® HD Power Module

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