XCede® HD High-Density Backplane System

XCede® HD High-Density Backplane System

Small form factor high-density backplane system ideal for density-critical applications, with a modular design and optional features for flexibility and customizable solutions.


FAMILY OVERVIEW

xcede hd

XCede® HD combines a small form factor with incredible design flexibility for significant board and system space savings. The system’s modularity gives designers the opportunity to create a fully custom backplane solution with optional power modules, guidance & keying, and side walls for increased durability. Featuring a staggered differential pin design, the ground pins mate first for hot-plugging to help prevent system downtime.

Modular Design

XCede® HD consists of signal, power and keying/guidance modules for incredible design flexibility. The modules can be customized in any configuration to meet specific application requirements.

How to build a full solution:

  • Right-angle modules can be built into a single customizable BSP part. Build a BSP part by combining any number, in any configuration, of HDTFs, power and keying/guidance modules to create one receptacle.
  • Header modules mount to the backplane individually, in any configuration of HDTM and HPTS parts.
  • Build Your Custom XCede® HD Solution
  • Contact HSBP@samtec.com for more information about building a full XCede® HD solution.
xcede assembly

FEATURES

  • Up to 84 differential pairs per linear inch
  • 1.80 mm column pitch
  • 3-, 4- and 6-pair designs
  • 4, 6 or 8 columns
  • 12 - 48 pairs
  • Up to a 3.00 mm contact wipe on signal pins
  • Multiple signal/ground pin staging options
  • Integrated power, guidance, keying and side wall options available
  • 85 Ω and 100 Ω options
  • Three levels of sequencing enable hot plugging
  • Cost-effective designs available for low-speed applications
xcede power guide

DOWNLOADS

Literature

High-Density Backplane Headers & Sockets

XCede® HD eBrochure

Get
High-Speed Board-to-Board Application Guide

High-Speed Board-to-Board Application Guide

Get
Broadcast Video Solutions Guide

Broadcast Video Solutions Guide

Get

Products

HDTF

XCede® HD 1.80 mm High-Density Backplane Right-Angle Receptacle

Features
  • 3-, 4- and 6-pair designs
  • 4, 6 or 8 columns
  • Standard or high-speed wafers available
  • 85 Ω and 100 Ω options
  • Modular design provides flexibility in applications
XCede® HD 1.80 mm High-Density Backplane Right-Angle Receptacle

HDTM

XCede® HD 1.80 mm High-Density Backplane Vertical Header

Features
  • 3-, 4- and 6-pair designs
  • 4, 6 or 8 columns
  • Three levels of sequencing enable hot plugging
  • Up to 3.00 mm contact wipe on signal pins
  • Integrated guidance, keying and polarizing side walls available
XCede® HD 1.80 mm High-Density Backplane Vertical Header

BSP

XCede® HD High-Density Backplane Custom Right-Angle Module

Features
  • Fully custom module to meet specific application requirements
  • Combine any number, in any configuration of HDTF (signal), power and keying/guidance to create one BSP product
  • Power and keying/guidance available for custom configurations only
  • For a signal only solution, see HDTF Series
  • Contact HSBP@samtec.com for assistance building a BSP product
XCede® HD High-Density Backplane Custom Right-Angle Module

HPTS

XCede® HD Power Module

Features
  • Mounts individually to backplane
  • Variety of body heights to match signal module pair count
  • Press-fit tails
  • Vertical Mount
XCede® HD Power Module

More High-Speed Backplane Systems

CONTACT SALES

First Name
Last Name
Email
Company
Industry
Estimate Annual Usage
Family
Message

Don't want to fill out a form?
Chat with a product expert directly.

.
In the last several months of website updates, we’ve sprinkled in some tidbits about our static website conversion project. This project entails converting many areas of the Samtec.com website from being served from web server storage and sometimes slower database lookups to serv...
COVID-19 is slowly fading away. People are returning to a normal life. Students look forward to summer. Families are planning holidays. Friends and colleagues are sharing meals in restaurants. In the business world, virtual meetings are still a reality. Yet, many professionals ye...
IMS 2022 is a week dedicated to all things microwave and RF. It’s the premier event where thousands of RF and microwave professionals will gather this June for networking, education, and to visit the exhibition. Samtec is looking forward to presenting our newest microwave / milli...
Data is the raw material of the future. The advent of the Internet of Things has transformed many activities in the modern world, from growing the food we eat to the way our healthcare is provided. Enabled by the increased capabilities of modern processors and the speed of the la...
Samtec has released its 1.35 mm family of products suitable for millimeter wave applications to 90 GHz. The 1.35 mm family includes compression mount board connectors (135 Series), cable connectors (PRF13 Series) and .047″ low-loss flexible cable assemblies (RF047-A Series). 1.35...