XCede® HD High-Density Backplane System

Small form factor high-density backplane system ideal for density-critical applications, with a modular design and optional features for flexibility and customizable solutions.


FAMILY OVERVIEW

XCede® HD combines a small form factor with incredible design flexibility for significant board and system space savings. The system’s modularity gives designers the opportunity to create a fully custom backplane solution with optional power modules, guidance & keying, and side walls for increased durability. Featuring a staggered differential pin design, the ground pins mate first for hot-plugging to help prevent system downtime.

FEATURES

Features

  • Up to 84 differential pairs per linear inch
  • 1.80 mm column pitch
  • 3-, 4- and 6-pair designs
  • 4, 6 or 8 columns
  • 12 - 48 pairs
  • Up to a 3.00 mm contact wipe on signal pins
  • Multiple signal/ground pin staging options
  • Integrated power, guidance, keying and side wall options available
  • 85 Ω and 100 Ω options
  • Three levels of sequencing enable hot plugging
  • Cost-effective designs available for low-speed applications

Modular Design

XCede® HD consists of signal, power and keying/guidance modules for incredible design flexibility. The modules can be customized in any configuration to meet specific application requirements.

How to build a full solution:

  • Right-angle modules can be built into a single customizable BSP part. Build a BSP part by combining any number, in any configuration, of HDTFs, power and keying/guidance modules to create one receptacle.
  • Header modules mount to the backplane individually, in any configuration of HDTM and HPTS parts.
  • Contact HSBP@samtec.com for more information about building a full XCede® HD solution.

DOWNLOADS

Literature

High-Speed Board-to-Board Application Guide

High-Speed Board-to-Board Application Guide

Get
Broadcast Video Solutions Guide

Broadcast Video Solutions Guide

Get

SERIES

HDTF

XCede® HD 1.80 mm Right-Angle Backplane Receptacle

Features
  • 3-, 4- and 6-pair designs
  • 4, 6 or 8 columns
  • Standard or high-speed wafers available
  • 85 Ω and 100 Ω options
  • Modular design provides flexibility in applications
XCede® HD 1.80 mm Right-Angle Backplane Receptacle

HDTM

XCede® HD 1.80 mm Vertical Backplane Header

Features
  • 3-, 4- and 6-pair designs
  • 4, 6 or 8 columns
  • Three levels of sequencing enable hot plugging
  • 4.00 mm contact wipe
  • Integrated guidance, keying and polarizing side walls available
XCede® HD 1.80 mm Vertical Backplane Header

BSP

XCede® HD Custom Right-Angle Module

Features
  • Fully custom module to meet specific application requirements
  • Combine any number, in any configuration of HDTF (signal), power and keying/guidance to create one BSP product
  • Power and keying/guidance available for custom configurations only
  • For a signal only solution, see <a href="../../../products/hdtf">HDTF Series</a>
  • Contact <a href="mailto:HSBP@samtec.com">HSBP@samtec.com</a>&nbsp;for assistance building a BSP product
XCede® HD Custom Right-Angle Module

HPTS

3.20 mm XCede® HD Power Module

Features
  • Mounts individually to backplane
  • Variety of body heights to match signal module pair count
  • Press-fit tails
  • Vertical Mount
3.20 mm XCede® HD Power Module

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