High-speed, high-density backplane systems include ExaMAX® and XCede® HD in a variety of pair and column counts. ExaMAX® enables up to 56 Gbps performance and allows designers the option to optimize density or minimize board layer count. XCede® HD is a small form factor system with a modular design for significant space savings and flexibility.
ExaMAX® high-speed backplane interconnects deliver 56 Gbps electrical performance.
ExaMAX® is engineered for 92 Ω impedance to address both 85 Ω and 100 Ω applications.
View Performance ChartsSmall form factor high-density backplane system ideal for density-critical applications, with a modular design and optional features for flexibility and customizable solutions.
XCede® HD consists of signal, power and keying/guidance modules for incredible design flexibility. The modules can be customized in any configuration to meet specific application requirements.
View Performance ChartsExaMAX® high-speed backplane interconnects deliver 56 Gbps electrical performance.
ExaMAX® increases architectural flexibility by overcoming the limitations of a traditional connector-to-connector backplane.
See High-Density Application Example