VITA 42 XMC Standard Products and Support

VITA 42 XMC is a widely deployed mezzanine Standard used in high-reliability computers implementing switched-fabric architectures. XMC combines PCI Mezzanine Card (PMC) with serial fabric technology on proven mezzanine form-factors.

In 2017, VITA updated XMC’s base specification to recommend solderball connectors. Original parts employed Paste-On-Pad attachment, while recommended parts utilize modern solderball technology. Listed below are the recommended SamArray connectors, plus optional JSOM ejector standoffs to assist in XMC card un-mating.


VITA 42

VITA 42 - SamArray

VITA 42 XMC specifies solderball-equipped SamArray connectors in 10mm and 12mm stack heights. Solder options include Lead-free and Tin-lead alloys.

 

Samtec PN

Socket (Carrier Side)

10mm Mated

12mm Mated

LIF Contacts

Terminal
(Module Side)

Standard Height

Solder
Ball
Type
Options

Kapton Pad (-K)

Alignment Pins (-A)

Tape & Reel
(-TR)

Plating: H=30µ" Gold or E=50µ" Gold

Design Support

Prints

3D

PADS

ASP-103612-01

X

 

 

 

Tin-Lead

X

 

X

H

PDF Print

IGES
PARASOLID
STEP

PADS File

ASP-103612-02

X

 

 

 

Lead-Free

X

 

X

H

PDF Print

IGES
PARASOLID
STEP

PADS File

ASP-103612-03

X

 

 

 

Tin-Lead

 

 

 

H

PDF Print

IGES
PARASOLID
STEP

PADS File

ASP-103612-04

X

 

X

 

Lead-Free

X

 

X

H

PDF Print

IGES
PARASOLID
STEP

PADS File

ASP-103612-05

X

 

X

 

Tin-Lead

X

 

X

H

PDF Print

IGES
PARASOLID
STEP

PADS File

ASP-103614-01

 

 

 

X

Tin-Lead

X

 

X

H

PDF Print

IGES
PARASOLID
STEP

PADS File

ASP-103614-04

 

 

 

X

Lead-Free

X

 

X

H

PDF Print

IGES
PARASOLID
STEP

PADS File

ASP-189983-01

 

X

X

 

Tin-Lead

X

 

X

H

PDF Print

IGES
PARASOLID
STEP

PADS File

ASP-189983-02

 

X

X

 

Lead-Free

X

 

X

H

PDF Print

IGES
PARASOLID
STEP

PADS File

ASP-153860-01*

 

 

 

12mm

Lead-Free

X

 

X

H

PDF Print

IGES
PARASOLID
STEP

PADS File

ASP-153860-02*

 

 

 

12mm

Tin-Lead

X

 

X

H

PDF Print

IGES
PARASOLID
STEP

PADS File

*These are 2 mm taller than the Standard mezzanine connectors. While these have been used to achieve 12 mm stack heights, the VITA 42 XMC Standard recommends using ASP-103614-01 and ASP-103614-04.

VITA 42/V61 - JSOM

Some XMC mezzanine cards may present a challenge to unmate from their host. To aid in separation, Samtec has developed the JSOM (Micro Jack Screw Standoff.) They act as a traditional standoff when collapsed. An Allen-key unscrews and expands the jack screw, dividing the PCBs in a steady, even motion until the mezzanine is safely separated from its host. The JSOM standoff family includes M2.5, M3, and #4-40 hardware available in 10mm and 12mm stack heights.

VITA 42 (XMC) Micro Jack Screw Stand Offs (JSOM)
 

Samtec PN

 

Thread Locker

M2.5 Thread*

10mm

12mm

M3 Thread

10mm

12mm

#4-40 Thread

10mm

12mm

Design Support

Prints

3D

ASP-198471-02

YES

X

 

 

 

 

 

PDF Print

STEP

ASP-198471-03

YES

 

X

 

 

 

 

PDF Print

STEP

ASP-199169-02

YES

 

 

X

 

 

 

PDF Print

STEP

ASP-199169-03

YES

 

 

 

X

 

 

PDF Print

STEP

ASP-199167-02

YES

 

 

 

 

X

 

PDF Print

STEP

ASP-199167-03

YES

 

 

 

 

 

X

PDF Print

STEP

ASP-198471-05

NO

X

 

 

 

 

 

PDF Print

STEP

ASP-198471-06

NO

 

X

 

 

 

 

PDF Print

STEP

ASP-199169-05

NO

 

 

X

 

 

 

PDF Print

STEP

ASP-199169-06

NO

 

 

 

X

 

 

PDF Print

STEP

ASP-199167-05

NO

 

 

 

 

X

 

PDF Print

STEP

ASP-199167-06

NO

 

 

 

 

 

X

PDF Print

STEP

* - Meets VITA mezzanine standoff specifications

Expanding XMC Ecosystem

Expanding XMC Ecosystem

The XMC standard allows for greater configuration of embedded systems on both ends of the market. With a focus dedicated to flexibility, XMC allows the designer to add modules for greater performance, additional functionality, or to upgrade an existing XMC system. Due to this modular design, XMC is well-suited for a wide variety of technologies advancing at different rates, thus extending the resourcefulness of its mezzanine/carrier cards. Key features of XMC include:

  • High-speed switched interconnects
  • XMC connectors able to provide power, ground, and auxiliary signals to mezzanine
  • Compatibility with existing PMC specifications
  • Features Standard VME, CompactPCI, Advanced TCA, and PCI Express® carriers
  • Available in variable stacking heights of 10 mm and 12 mm

Technobox Reverse Compact XMC-to-PCIe® Adaptor 8X

The Technobox XMC to PCI Express® adaptor with Rear I/O support provides up to 8X lanes of connection from the XMC P15 connector to the PCI Express® edge finger. Additional configurations can support PCI Express® Gen 1 (2.5 Gb/s), Gen 2 (5 Gb/s), and Gen 3 (8 Gb/s).

Key features include:

  • Convection cooling airflow for lower power XMCs
  • Optional fan assembly (P/N 8254) for higher power XMCs
  • Can accommodate air or conduction-cooled configurations
  • DIP Switch configuration for geographical address, available power, and XMC status signals

Featured Samtec Products:

  • VITA 42 XMC (10 mm Lead-Free) 114 I/O Female Connector (SamArray® ASP-103612-04)

X-ES XPedite7501 5th Generation Intel® Core™ i7 Broadwell-H Processor-Based XMC Module

The XPedite7501 XMC module utilizes Intel’s 5th generation i7 Broadwell-H processor to provide high performance with low power consumption. Offering up to three PCI Express® Gen 3-capable ports and two Gigabit Ethernet ports, the XPedite7501 proves to be an ideal solution for high-bandwidth data processing applications.

Additional features include:

  • Intel® Iris™ Pro graphics which doubles as general-purpose GPU
  • Up to 8 GB of DDR3L-1600 ECC SDRAM in two channels
  • One x4 PCI Express® Gen 3-capable link
  • Meets XMC Form Factor
  • And much more…

Featured Samtec Products:

  • VITA 42 XMC (10 mm Lead-Free) 114 I/O Female Connector (SamArray® ASP-103614-01)

Test Reports

VITA 42 XMC Standard

For questions regarding the VITA 42 XMC Standard and additional information, please contact us at:

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