LP Array™ Low Profile Open-Pin-Field Arrays

Low profile open-pin-field arrays down to 4 mm stack height and up to 320 total I/Os.


FAMILY OVERVIEW

These low profile, high-speed arrays feature a dual beam contact system on a 1.27 mm x 1.27 mm (.050" x .050") pitch grid for maximum grounding and routing flexibility. This system is available in 4 mm, 4.5 mm and 5 mm mated heights with up to 320 total pins in 4, 6 or 8 row configurations.

They support 28+ Gbps applications and are also Final Inch® certified for Break Out Region trace routing recommendations to save designers time and money. Standard lead-free solder crimp simplifies IR reflow terminations and improves solder joint reliability.

FEATURES

  • 4 mm, 4.5 mm, 5 mm stack heights
  • Up to 320 I/Os
  • 4, 6 and 8 row designs
  • .050" (1.27 mm) pitch
  • Dual beam contact system
  • Solder crimp termination for ease of processing
  • Performance up to 18.5 GHz / 37 Gbps

DOWNLOADS

Literature

SEARAY™ LP eBrochure

LP Array™ eBrochure

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IC-to-Board

IC-to-Board

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High-Speed Board-to-Board Application Guide

High-Speed Board-to-Board Application Guide

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Technical Documents

SERIES

JSO

Jack Screw Precision Board Stacking Standoff

Features
  • Works as a traditional standoff
  • Assists with unmating LSHM, SEAM/SEAF, SEAM8/SEAF8, LPAM/LPAF and other high-normal-force connectors
  • Reduces risk for component damage on boards
  • Board stacks from 4.00 mm to 16.00 mm
  • Press-fit and threaded bases available
Jack Screw Precision Board Stacking Standoff

LPAF

.050" LP Array™ High-Speed High-Density Low Profile Open-Pin-Field Array, Socket

Features
  • Low profile 4 mm, 4.5 mm, 5 mm stack heights
  • Up to 320 I/Os
  • 4, 6 and 8 row designs
  • .050" (1.27 mm) pitch
  • Dual beam contact system
  • Solder crimp termination for ease of processing
  • Performance up to 18.5 GHz / 37 Gbps
  • Final Inch® patent pending
  • Samtec 28+ Gbps Solution
.050" LP Array™ High-Speed High-Density Low Profile Open-Pin-Field Array, Socket

LPAM

.050" LP Array™ High-Speed High-Density Low Profile Open-Pin-Field Array, Terminal

Features
  • Low profile 4 mm, 4.5 mm, 5 mm stack heights
  • Up to 320 I/Os
  • 4, 6 and 8 row designs
  • .050" (1.27 mm) pitch
  • Dual beam contact system
  • Solder crimp termination for ease of processing
  • Final Inch® patent pending
  • Samtec 28+ Gbps Solution
.050" LP Array™ High-Speed High-Density Low Profile Open-Pin-Field Array, Terminal

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