LP Array™ Low Profile Open-Pin-Field Arrays

LP Array™ Low Profile Open-Pin-Field Arrays

Low profile open-pin-field arrays down to 4 mm stack height and up to 400 total I/Os.


FAMILY OVERVIEW

searaylp poster

These low profile, high-speed arrays feature a dual beam contact system on a 1.27 mm x 1.27 mm (.050" x .050") pitch grid for maximum grounding and routing flexibility. This system is available in 4 mm, 4.5 mm and 5 mm mated heights with up to 400 total pins in 4, 6 or 8 row configurations.

They support 56 Gbps PAM4 applications and are also Final Inch® certified for Break Out Region trace routing recommendations to save designers time and money. Standard lead-free solder crimp simplifies IR reflow terminations and improves solder joint reliability.

FEATURES

  • 4 mm, 4.5 mm, 5 mm stack heights
  • Up to 400 I/Os
  • 4, 6 and 8 row designs
  • .050" (1.27 mm) pitch
  • Dual beam contact system
  • Solder crimp termination for ease of processing
  • 56 Gbps PAM4 Performance
searaylp flexibility

DOWNLOADS & RESOURCES

Literature

SEARAY™ LP eBrochure

LP Array™ eBrochure

Get
High-Speed Board-to-Board Application Guide

High-Speed Board-to-Board Application Guide

Get

Technical Documents

Products

LPAF

.050" LP Array™ High-Speed High-Density Low Profile Open-Pin-Field Array, Socket

Features
  • Low profile 4 mm, 4.5 mm, 5 mm stack heights
  • Up to 400 I/Os
  • 4, 6 and 8 row designs
  • .050" (1.27 mm) pitch
  • Dual beam contact system
  • Solder crimp termination for ease of processing
  • 28 Gbps NRZ/56 Gbps PAM4 performance
  • 56 Gbps PAM4 performance
.050" LP Array™ High-Speed High-Density Low Profile Open-Pin-Field Array, Socket

LPAM

.050" LP Array™ High-Speed High-Density Low Profile Open-Pin-Field Array, Terminal

Features
  • Low profile 4 mm, 4.5 mm, 5 mm stack heights
  • Up to 400 I/Os
  • 4, 6 and 8 row designs
  • .050" (1.27 mm) pitch
  • Dual beam contact system
  • Solder crimp termination for ease of processing
  • 56 Gbps PAM4 performance
.050" LP Array™ High-Speed High-Density Low Profile Open-Pin-Field Array, Terminal

JSO

Jack Screw Precision Board Stacking Standoff

Features
  • Works as a traditional standoff
  • Assists with unmating LSHM, SEAM/SEAF, SEAM8/SEAF8, LPAM/LPAF, ADM6/ADF6 and other high-normal-force connectors
  • Reduces risk for component damage on boards
  • Board stacks from 4.00 mm to 16.00 mm
  • Press-fit and threaded bases available
Jack Screw Precision Board Stacking Standoff

CONTACT SALES

First Name
Last Name
Email
Company
Industry
Estimate Annual Usage
Family
Message

Don't want to fill out a form?
Chat with a product expert directly.

.
A live product demonstration from DesignCon 2023 highlights the outstanding PCIe 6.0 performance of both a Samtec Flyover® high-speed cable assembly and a Rohde & Schwarz® ZNA vector network analyzer. […] The post Rohde & Schwarz VNA Verifies Excellent PCIe 6.0 Performance Of Hig...
One of the ways we continue to hold the #1 spot for several website categories in our industry is by making it easy for customers to get in touch with us and […] The post Try This Helpful New Way to Submit Website Feedback appeared first on The Samtec Blog....
In this live demonstration from DesignCon 2023, the performance of a Samtec high-speed cable system is measured by the world’s first scalable VNA. Matt Burns (Technical Marketing Manager, Samtec), and […] The post Cutting Edge High-Speed Cable Performance Measured By The World’s ...
A new connector system improves signal integrity by improving power integrity. Optimizing power integrity provides greater signal integrity margin and improves power and thermal efficiency.  The design of a high-speed […] The post Improve Power Integrity and Signal Integrity With...
It’s coming – embedded world 2023! Can you wait for it? No, it’s not The Mandalorian Season 3 (Wasn’t that awesome?!??!), but rather embedded world 2023. For embedded designers and […] The post Samtec Highlights Latest Interconnect Solutions at embedded world 2023 appeared first ...