LP Array™ Low Profile Open-Pin-Field Arrays

Low profile open-pin-field arrays down to 4 mm stack height and up to 320 total I/Os.


FAMILY OVERVIEW

These low profile, high-speed arrays feature a dual beam contact system on a 1.27 mm x 1.27 mm (.050" x .050") pitch grid for maximum grounding and routing flexibility. This system is available in 4 mm, 4.5 mm and 5 mm mated heights with up to 320 total pins in 4, 6 or 8 row configurations.

They support 28+ Gbps applications and are also Final Inch® certified for Break Out Region trace routing recommendations to save designers time and money. Standard lead-free solder crimp simplifies IR reflow terminations and improves solder joint reliability.

FEATURES

  • 4 mm, 4.5 mm, 5 mm stack heights
  • Up to 320 I/Os
  • 4, 6 and 8 row designs
  • .050" (1.27 mm) pitch
  • Dual beam contact system
  • Solder crimp termination for ease of processing
  • Performance up to 18.5 GHz / 37 Gbps

DOWNLOADS

Literature

SEARAY™ LP eBrochure

LP Array™ eBrochure

Get
IC-to-Board

IC-to-Board

Get
High-Speed Board-to-Board Application Guide

High-Speed Board-to-Board Application Guide

Get

Technical Documents

SERIES

JSO

Jack Screw Precision Board Stacking Standoff

Features
  • Works as a traditional standoff
  • Assists with unmating LSHM, SEAM/SEAF, SEAM8/SEAF8, LPAM/LPAF and other high-normal-force connectors
  • Reduces risk for component damage on boards
  • Board stacks from 4.00 mm to 16.00 mm
  • Press-fit and threaded bases available
Jack Screw Precision Board Stacking Standoff

LPAF

.050" LP Array™ High-Speed High-Density Low Profile Open-Pin-Field Array, Socket

Features
  • Low profile 4 mm, 4.5 mm, 5 mm stack heights
  • Up to 320 I/Os
  • 4, 6 and 8 row designs
  • .050" (1.27 mm) pitch
  • Dual beam contact system
  • Solder crimp termination for ease of processing
  • Performance up to 18.5 GHz / 37 Gbps
  • Final Inch® patent pending
  • Samtec 28+ Gbps Solution
.050" LP Array™ High-Speed High-Density Low Profile Open-Pin-Field Array, Socket

LPAM

.050" LP Array™ High-Speed High-Density Low Profile Open-Pin-Field Array, Terminal

Features
  • Low profile 4 mm, 4.5 mm, 5 mm stack heights
  • Up to 320 I/Os
  • 4, 6 and 8 row designs
  • .050" (1.27 mm) pitch
  • Dual beam contact system
  • Solder crimp termination for ease of processing
  • Final Inch® patent pending
  • Samtec 28+ Gbps Solution
.050" LP Array™ High-Speed High-Density Low Profile Open-Pin-Field Array, Terminal

A key component of any high-speed signal path is the interconnect.  Design engineers must identify the right connector (or connectors) and the best performance for the application. At 56 Gbps PAM4 data rates (and higher), connector selection becomes more challenging. Interconnect...
It’s been over a year since we last updated the Samtec homepage. As you may have already noticed, we recently took some time to refresh it. You can see a comparison below of the old homepage (top), vs the new homepage (bottom). The new update puts more attention on our high speed...
If you manufacture overseas and ship into the U.S.A, you may have a longer waiting time in Customs than you would prefer.  Some of this waiting time could be eliminated by becoming part of the Customs Trade Partnership Against Terrorism (C-TPAT), one layer of the U.S. Customs and...
Just about everybody wishes they had more time to pursue a hobby or a side project.  Some aspire to be painters or furniture makers.  Others like to rebuild cars.  Even others enjoy electronics in any form. The Maker Movement attracts and caters to tinkerers, hobbyists, students ...
Demand For High Data Rate As the need for bandwidth continues to increase, so does the need for higher data rates within a system. What was once one to three Gbps, then moved to 4 to 8 Gbps, and now we are approaching 28 Gbps and looking forward to 56 G. This trend was recently [...
View Full Site