FireFly™ Micro Flyover System™

Future-proof system with interchangeability of FireFly™ copper and optical using the same micro connector system for up to 28 Gbps per lane in x4 and x12 configurations.


FAMILY OVERVIEW

FireFly Micro Flyover System™ is the first interconnect system that gives a designer the flexibility of using micro footprint high-performance optical and low-cost copper interconnects interchangeably with the same connector system.

FireFly copper and optical cable systems provide the flexibility to achieve higher data rates to 28 Gbps and/or greater distances by flying data over lossy PCB, simplifying board design and enhancing performance.

The system’s miniature footprint allows for greater density and closer proximity to the IC, enabling chip-to-chip, board-to-board, on-board and system-to-system connectivity.

The Firefly™ Micro Flyover System is the first interconnect system that gives designers a choice of using either micro footprint optical or copper interconnects to meet today's data rate requirements and the next generation.

FEATURES

Future Proof

FireFly™ copper and optical systems are interchangeable using the same high-performance connector set.

FireFly Copper

  • Performance to 28 Gbps
  • x4 bidirectional or x12 unidirectional
  • 100 Ω, 34 or 36 AWG Eye Speed® twinax cable
  • Variety of end 2 termination options
  • Low-profile housing for space savings
  • Low-cost solution for seamless integration of new and existing designs
  • Standard copper (ECUE), optimized copper (ECUE-2) and PCIe®-Over-FireFly copper (PCUE) assemblies available
ECUE Twinax Ribbon Cable

FireFly Optical

  • Performance to 28 Gbps
  • x4 and x12 designs
  • OM3 multi-mode fiber
  • Variety of End 2 options and heat sinks for various cooling processes
  • Extended Temperature FireFly with a -40 ºC to +85 ºC range for military and industrial applications (ETUO)
  • PCIe®-Over-Fiber optical cable system with Gen 3 data transfer rates to 100 m (PCUO)
  • PCIe®-Over-Fiber adaptor card supports transparent and non-transparent bridging (PCOA)
ECUO Active Optical Cable

Highest Density

The industry-leading miniature footprint of FireFly™ allows for greater density and closer proximity to the IC, which simplifies board layout and enhances signal integrity. Performance from 14 Gbps to 28 Gbps can be achieved in the same footprint covering an area of only 0.63 square inches for an aggregate 265 Gbps/in².

Ease of Routing

The two-piece board level interconnect system consists of a micro high-speed edge card connector, and a positive latch connector for power and low speed control signal communications. Isolating the signal and power in this manner helps ease trace routing, compared to array systems.

UEC5 – High-Speed Edge Card Connector
  • Gen 1 – up to 20 Gbps
  • Gen 2 – 20+ Gbps
UCC8 – Positive Latch Connector

Ease of Assembly

The rugged two-piece edge card socket system, with weld tabs, latch locking mechanism, and loading guides, provides simplified mating and unmating of the cable assembly, compared to compression systems, which utilize mechanical screw downs and hardware.

Unlike existing optical engine-based solutions, thermal operating conditions are acknowledged and designed for by including an integral heat sink. This integral heat sink further simplifies the assembly process. Standard heat sinks are available in several designs, including finned, flat, fiber-groove for multi-row configurations, and custom designs, for conduction or convection cooling.

Signal Integrity

By taking the data connections "off-board" with FireFly flyover cables, the signal integrity design is made significantly easier, and the electrical performance improved.

Allowing data to "fly over" lossy board materials and other signal degrading components negates the need for the layout complexities that are required to design for high speed signaling.

Test Kit

Rated up to 28 Gbps, this kit allows the designer real-time evaluation of an actively running copper or optical FireFly™ system in their lab, with their inputs.

The evaluation board connects the FireFly™ connector system (UEC5/UCC8) to a 24-position Bulls Eye® system and brings the low-speed signals and power rails to various standard connectors. The Bulls Eye® system allows for connecting all 12 FireFly™ channels to various laboratory test equipment. A second Bulls Eye® connector landing pad enables the de-embedding of the Bulls Eye® interconnect and PCB effects on the high-speed signals.

Part Number: FIK-FIREFLY-XX

Development Kit

Samtec's 14 Gbps FireFlyTM FMC Module provides up to 140 Gbps full-duplex bandwidth over 10 channels from an FPGA to an industry-standard multi-mode fiber optic cable. The optical engines in FireFlyTM provide adjustable power levels to support cable lengths up to 100 m.

As a VITA 57.1 FMC, the module can be used for optical data communication on any FPGA development board supporting high-speed multi-gigabit transceivers. It can run system data or BERT testing on all channels in parallel. This makes evaluation and development with an FPGA much easier and is an ideal substitute for 28G test equipment.

Part Number: REF-193429-01

DOWNLOADS

Literature

SERIES

ECUO

FireFly™ Active Optical Micro Flyover Cable Assembly

Features
  • FireFly™ optical cable system
  • Data "flies" over the PCB for easier routing
  • Interchangeable with FireFly™ copper
  • Choice of data rate: 14 Gbps, 16 Gbps, 25 Gbps, 28 Gbps
  • Designed for on-board or on-package placement
  • Variety of integral heat sink, fiber type and End 2 options
  • FireFly™ evaluation kit available. Active optical cable assembly sold separately
  • For more information, contact <a href="mailto:firefly@samtec.com">firefly@samtec.com</a>
FireFly™ Active Optical Micro Flyover Cable Assembly

ETUO

FireFly™ Extended Temperature Active Optical Micro Flyover Cable Assembly

Features
  • Extended temperature range from -40 ºC to +85 ºC
  • High-speed performance to 10.3125 Gbps per channel
  • Data "flies" over the PCB for easier routing
  • Integral heat sink provides optimal cooling for thermal operating conditions
  • Variety of fiber type and End 2 options
  • For more information, contact <a href="mailto:firefly@samtec.com">firefly@samtec.com</a>
FireFly™ Extended Temperature Active Optical Micro Flyover Cable Assembly

PCUO

PCIe® Optical Flyover Cable Assembly

Features
  • Meets PCIe® Gen 3 specifications
  • Transmits PCIe® signals up to 100 m
  • x4, x8 and x16 PCIe® micro optical engines
  • Transparent and non-transparent bridging
  • Proven 850 nm VCSEL technology
  • Compatible PCIe® adaptor card available (PCUO Series)
PCIe® Optical Flyover Cable Assembly

PTUO

Extended Temp PCIe®-Over-Fiber Cable Assembly

Features
  • Extended temperature range from -5 degree C to +85 degree C
  • Industrial temperature range from -40 degree C to +85 degree C
  • Meets PCIe® Gen 3 specifications
  • Transmits PCIe® signals up to 100 m
  • x4, x8 and x16 PCIe® micro optical engines
  • Transparent and non-transparent bridging
  • Proven 850 nm VCSEL technology
Extended Temp PCIe®-Over-Fiber Cable Assembly

ECUE

FireFly™ Low Profile Micro Flyover Cable Assembly

Features
  • FireFly™ copper cable system
  • Data "flies" over the PCB for easier routing
  • Interchangeable with FireFly™ optical
  • Designed for on-board or on-package placement
  • Wide variety of End 2 options
  • 14 Gbps performance
  • Multiple signal mapping options
  • Low-cost solution for seamless integration of new and existing architectures
  • For more information, contact <a href="mailto:firefly@samtec.com">firefly@samtec.com</a>
FireFly™ Low Profile Micro Flyover Cable Assembly

PCUE

PCIe® Twinax Flyover Cable Assembly

Features
  • PCIe®-Over-FireFly™ copper system
  • x4 duplex system
  • Meets PCIe® Gen 3 specifications
  • Data "flies" over the PCB for easier routing
  • Mates with the same 2-piece connector system as other FireFly™ systems
  • 34 AWG twinax ribbon cable
PCIe® Twinax Flyover Cable Assembly

UEC5-1

Up To 20 Gbps FireFly™ Edge Card Socket Assembly

Features
  • Up to 20 Gbps performance
  • Rugged Edge Rate® contact system
  • Low profile right-angle design
  • Available in 19 positions
  • Standard alignment pins and surface mount tails
  • Selective gold plated contacts
  • PCB footprints are not interchangeable for UEC5-1 and UEC5-2 data rate versions
Up To 20 Gbps FireFly™ Edge Card Socket Assembly

UEC5-2

20+ Gbps FireFly™ Edge Card Socket Assembly

Features
  • 20+ Gbps performance
  • Rugged Edge Rate® contact system
  • Low profile right-angle design
  • Available in 19 positions
  • Selective gold plated contacts
  • Standard alignment pins and surface mount tails
  • PCB footprints are not interchangeable for UEC5-1 and UEC5-2 data rate versions
20+ Gbps FireFly™ Edge Card Socket Assembly

UCC8

FireFly™ Positive Latching Receptacle

Features
  • Power and low-speed control signal communications
  • Available in 10 positions
  • Selective gold plated contacts
  • Standard alignment pins and weld tabs
  • Part of the 2-piece connector set for FireFly™ optical and copper systems
FireFly™ Positive Latching Receptacle

PCOA

PCIe®-Over-Fiber Adaptor Card eBrochure

Features
  • Uses PCUO FireFly™ optical cable assemblies
  • Supports PCIe® Gen 3 platform; Gen 4 in development
  • PCIe® x16 edge card connector
  • x16, x8, dual x8, x4, dual x4 and quad x4 configurations
  • Transparent or non-transparent bridging
  • Reconfigurable host or target operation
PCIe®-Over-Fiber Adaptor Card eBrochure

FIK-FIREFLY-XX

FireFly™ Test Kit

Features
  • Optical and copper cable assemblies sold separately
  • Real-time evaluation of optical or copper FireFly™ system
  • Rated up to 25 Gbps
  • Bulls Eye® system allows connection to test equipment
  • USB to I2C adapter included
  • See print for total list of kit contents
FireFly™ Test Kit

More Mid Board Optics Systems

Any engineer who has designed an IC-based solution likely used some sort of HW development tool. Semiconductor manufacturers have a long history of providing engineers with the HW tools needed to test their silicon. Evaluation platforms, like the Xilinx® Zynq UltraScale+ RFSoC ZC...
Samtec offers one of the industry’s largest and most flexible lines of two-piece, pin-and-socket board-stacking interconnects. To say it another way, we have more ways to stack two or more boards together than any other connector company.  Also, you can specify a custom stack hei...
EDI CON USA brings together RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, product demonstrations, training, and learning opportunities. And as you have probably already guessed, Samtec will be attending EDI CON.  We will be...
In September, we spent some time focusing on our checkout process, continued to improve our industry standards experience, and released a few new content pages. We also rolled out the first version of our new Samtec Cares website. More on these and the rest of the major updates t...
As with many things, nothing stays the same; especially in the world of technology.  Samtec continues to improve and refine its offerings with Glass Core Technology (GCT), and with that there is also a need to update the materials surrounding it. Tell me more Through Glass Vias (...
View Full Site