High-Speed Mezzanine System Optimization

The integration of Samtec’s Technology Centers enables a unique level of expertise in mezzanine system optimization, from signal integrity design and analysis, layout and routing optimization strategies, to revolutionary point-to-point simulation tools that assess the performance of an entire channel using unique design parameters.

Samtec Teraspeed Consulting

Advanced support for full system + cost optimization.

Full channel cost and performance analysis

Full channel cost and performance analysis

Advanced break out region support, including Differential Vias™ for arrays

Advanced break out region support, including Differential Vias™ for arrays

Modeling, simulation, measurement methodology development

Modeling, simulation, measurement methodology development

Power delivery and thermal management assistance

Power delivery and thermal management assistance

ADVANCED INTERCONNECT DESIGN

Systems engineered for maximum density + performance.

Design flexibility with ultra low profile high-density micro interposers

Design flexibility with ultra low profile high-density micro interposers

Innovative solutions for high-performance applications

Innovative solutions for high-performance applications

High-density and space-saving designs

High-density and space-saving designs

High-density open-pin-field arrays with maximum routing flexibility

High-density open-pin-field arrays with maximum routing flexibility

PRACTICAL APPLICATIONS

Signal integrity expertise enables full channel optimization of high-performance mezzanine systems.

SerDes DESIGN APPLICATIONS

Samtec offers unparalleled support for SerDes applications via the expertise of Samtec Teraspeed Consulting, which includes:

  • Optimization of connectivity between the mezzanine connector and the main board
  • Full channel analysis and measurement (channel loss, reflection loss and crosstalk noise)
  • Full system validation: signal integrity analysis, specification compliance, performance and power management modeling
  • Material selection and trace design to optimize SerDes channels
  • Advanced breakout region layout and routing assistance:
    • Tri-Planar™ Transmission Lines — high-density routing of differential signals with less impedance and lower loss than microstrip
    • Differential Vias™ — provide better signal integrity at high data rates over traditional high-density array designs
With Samtec Teraspeed Consulting involvement
Without Samtec Teraspeed Consulting involvement

CHANNELYZER™ ONLINE FULL CHANNEL SIMULATION AND ANALYSIS

High-speed serial channel performance data and optimization strategies delivered within 24 hours
High-speed serial channel performance data and optimization strategies delivered within 24 hours.

Samtec’s Channelyzer™ delivers high-speed serial channel performance data and optimization strategies within 24 hours. Leveraging user-defined system inputs, this easy-to-use tool provides the necessary data to reinforce channel confidence. Features of Channelyzer™ include:

  • Channel modeling defined by package model, connector selection, PCB material, trace type and length and other system variables
  • Produces results for standards (IEEE 802.3bj 100GBASE-KR4, OIF CEI-28G-SR, OIF CEI-28G-MR and OIF CEI-25G-LR) and transceivers at varying equalization levels and data rates
  • Generates individual receiver performance data per user-defined Tx/Rx assignments
  • Channelyzer™ reporting details include:
    • Channel overview and strategies for improved performance
    • Differential impedance, insertion loss, return loss, PSXT
    • Voltage bathtub curves
    • COM as a function of BER
    • Probability density eye summary

Simulate and analyze your high-speed serial channel at samtec.com/channelyzer.

HIGH-DENSITY ARRAYS + MICRO INTERPOSERS

SEARAY™ OPEN-PIN-FIELD ARRAYS

  • .050" (1.27mm) pitch grid for maximum routing flexibility
  • Up to 500 I/Os in open-pin-field design
  • Performance up to 36 Gbps
  • Rugged Edge Rate® contact system less prone to damage when “zippered” during unmating
  • Solder on each tail for ease of processing (tin-lead or lead-free)
  • Standard stack heights from 7mm to 40mm
  • Optional guide posts for blind mating
  • 85 Ω tuned and press-fit tails available
  • VITA 47, VITA 57.1 and VITA 57.4
  • IPC-A-610F and IPCJ-STD-001F Class 3 solder joint
  • On-demand tools, including the Channelyzer™ Getting Started Guide and how-to video , help users simulate and analyze their high-speed serial channel quickly at https://www.samtec.com/channelyzer.
Searay™ Open-Pin-Field Arrays

SEARAY™ 0.80 mm ULTRA HIGH-DENSITY ARRAYS

  • 0.80 mm pitch grid
  • Up to 50 % board space savings
  • Performance: Up to 17.5 GHz / 35 Gbps
  • Rugged Edge Rate® contact system
  • 7 mm and 10 mm stack heights
  • Vertical and right-angle
  • High pin count 960 I/Os in development
Searay™ Open-Pin-Field Arrays

Z-RAY® ULTRA MICRO INTERPOSERS

  • Ideal for board-to-board, cable-to-board and complex IC-to-board applications
  • Dual compression BeCu contacts
  • One piece design on 0.80 mm o r1.00 mm pitch grid
  • High speed performance up to 28 Gbps and 56 Gbps with a migration path to 100 Gbps
  • Low profile 1 mm body height
  • Low 25 g normal force with .008" (0.20 mm) contact deflection
  • Single compression with solder ball
  • Ultra flexible, with a variety of standard and custom configurations, including dual compression, solder ball, and an array of sizes and shapes
  • Choice of fastener options, including application specific designs, screw downs, quick install (easy on/off) and thermal spreaders
  • Contact zray@samtec.com or visit samtec.com/zray for more information
Searay™ & Searay™ .8 mm
Searay™ & Searay™ .8 mm

TECHNOLOGY ROADMAP | HIGH-DENSITY ARRAYS + MICRO INTERPOSERS

Ultra High-Speed Z-Ray®

56 Gbps performance with migration path to 100 Gbps

Extreme Low Profile Z-Ray®

0.30 mm stack height interposer with Kapton core

Z-Ray® Multilayer System

Pitch spreaders and other embedded interconnect circuitry

Extreme High-Speed Z-Ray®

112 Gbps performance system

Searay™ Power Modules

Add-on modules for up to 20 A with 1.27 mm & 0.80 mm pitch grid SEARAY™

Searay™ Optical Systems

Right-angle array with integrated optics to support VITA 74

Searay™ Extended Wipe

Right-angle & vertical arrays with 2.00 mm extended contact wipe

Next Generation Array

Higher speed arrays achieved with PCB routing and design strategies to reach 56 Gbps

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