Mezzanine Systems for Next Gen Speeds

Samtec helps address the challenges of next generation data rate requirements with industry-leading interconnect expertise, along with full system optimization services and support, including a vast library of development platforms and characterization kits for high-performance interconnect systems. Samtec’s expanding line of proven High-Speed Mezzanine solutions engineered for 28 / 56 Gbps speeds includes extreme density arrays and ultra-high-density strips, along with optional mating cable systems.

Overview

NovaRay™ 56 Gbps NRZ Arrays

NovaRay™ Extreme Density Arrays are optimized for the demands of 56 Gbps systems and beyond, with a roadmap to 112 Gbps PAM4. Attributes include low crosstalk, tight impedance control and industry-leading data rates and density. Cable systems are also available.

Extreme Density Arrays & Cables

AcceleRate® HD 56 Gbps Strips

AcceleRate® HD Ultra-High-Density, Multi-Row Strips are incredibly dense with up to 240 total I/Os, a slim 5 mm width, and a low 5 mm stack height. Edge Rate® contacts are optimized for signal integrity and enable support of 56 Gbps PAM4 (28 Gbps NRZ) applications.

Ultra-High-Density Multi-Row Strips on 0.635 mm Pitch

SEARAY™ High-Density Arrays

SEARAY™ Open-Pin-Field Arrays enable maximum grounding and routing flexibility; Low Profile & Ultra High-Density designs are also available. SEARAY™ VITA 57.1 FMC / VITA 57.4 FMC+ connectors are engineered to aid in application development.

Open-Pin-Field Arrays, VITA 57.1 FMC & VITA 57.4 FMC+

Development Platforms

Microsemi® PolarFire™ Evaluation Kit

Ideal for high-speed transceiver evaluation, 10 Gb Ethernet, IEEE1588, JESD204B, SyncE, SATA and more, the Microsemi® PolarFire™ Evaluation Kit leverages Samtec’s SEARAY™ VITA 57.1 FMC connectors. Features include:

  • Connections via a High Pin Count (HPC) FPGA Mezzanine Card (FMC), numerous SMAs, PCIe®, Dual Gigabit Ethernet RJ45, SFP+ and USB
  • Mating connectors for the mezzanine card include ASP-134488-01 for 10 mm stack and ASP-134602-01 for 8.50 mm stack

View additional details at: samtec.com/fmc.

Microsemi® PolarFire™ Evaluation Kit

FMC / FMC+ Development Kits & Boards

Samtec offers a variety of development kits and boards featuring SEARAY™ VITA 57.1 FMC and VITA 57.4 FMC+ connectors that are designed to help simplify design and reduce time to market.

View details and additional kits at samtec.com/fmc or samtec.com/fmc-plus.

FMC / FMC+ Development Kits & Boards

SI Characterization Kits

Samtec Signal Integrity Characterization Kits help simplify the design process and reduce time to market. Kits are available for many of our high-performance connector sets and standard high-speed cable assembly configurations. Custom kits are also available.

View details at samtec.com/kits or contact kitsandboards@samtec.com for the current list of available kits.

SI Characterization Kits

Families

NovaRay™NovaRay ™ 112 Gbps PAM4, Extreme Density Arrays

NovaRay™ combines extreme density and performance for 112 Gbps PAM4 per channel in 40% less space than traditional arrays.

Features
  • 112 Gbps PAM4 per channel
  • 4.0 Tbps aggregate data rate - 9 IEEE 400G channels
  • Innovative, fully shielded differential pair design enables extremely low crosstalk (to 40 GHz) and tight impedance control
  • 112 differential pairs per square inch
  • Two points of contact ensure a more reliable connection
  • 92 Ω solution addresses both 85 Ω and 100 Ω applications
Series
V
  • NVAM
  • NVAF
  • NVAC
  • NVAM-C
NovaRay™

AcceleRate® HDAcceleRate® HD Ultra-Dense Multi-Row Mezzanine Strips

These 0.635 mm pitch high-density multi-row mezzanine strips feature up to 240 high-speed Edge Rate® contacts in a slim, low-profile design.

Features
  • Incredibly dense with up to 240 total I/Os
  • Low profile 5 mm stack height
  • Slim 5 mm width
  • 4-row design; 10 - 60 positions per row (40 - 240 total positions)
  • Edge Rate® contact system optimized for signal integrity performance
  • Supports 56 Gbps PAM4 (28 Gbps NRZ) applications
  • Solder ball technology for simplified processing and self aligning
  • Additional stack heights and higher pin counts in development
Series
V
  • ADM6
  • ADF6
AcceleRate® HD

SEARAY™SEARAY™ High-Density Open Pin Field Arrays

These high-speed, high-density open pin field arrays allow maximum grounding and routing flexibility.

Features
  • Maximum routing and grounding flexibility
  • Lower insertion/extraction forces vs. typical array products
  • Performance up to 18 GHz/pair
  • Up to 500 I/Os in open pin field design
  • 1.27 mm (.050") pitch and space saving 0.80 mm pitch
  • Rugged Edge Rate® contact system
  • Can be "zippered" during mating/unmating
  • Solder charge terminations for ease of processing
  • Meets Extended Life Product™ (E.L.P.™) standards
  • 7 - 17 mm stack heights
  • Vertical, right-angle, press-fit
  • Elevated systems to 40 mm
  • 85 ohm systems
  • VITA 47, VITA 57, Pismo 2 certified
  • IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products (SEAM/SEAF series only)
  • IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products (SEAM/SEAF series only)
Series
V
  • SEAF
  • SEAM
  • SEAF-RA
  • SEAM-RA
  • SEAMP
  • SEAFP
  • SEAFP-RA
  • SEAR
  • SEAMI
  • JSO
  • UBPS
  • UBPT
SEARAY™

LP Array™LP Array™ Low Profile Open-Pin-Field Arrays

Low profile open-pin-field arrays down to 4 mm stack height and up to 320 total I/Os.

Features
  • 4 mm, 4.5 mm, 5 mm stack heights
  • Up to 320 I/Os
  • 4, 6 and 8 row designs
  • .050" (1.27 mm) pitch
  • Dual beam contact system
  • Solder crimp termination for ease of processing
  • Performance up to 18.5 GHz / 37 Gbps
Series
V
  • JSO
  • LPAF
  • LPAM
LP Array™

Samtec performs several tests in-house as part of our qualification testing on a product series; including Low Level Contact Resistance (LLCR). It measures the amount of resistance in a position on a part. LLCR is used in combination with several other tests to track the overall ...
Makers of Louisville and Southern Indiana – Assemble! Obviously, the Samtec blog team has been watching too many superhero and Ron Burgundy movies.  However, the point still remains that this weekend marks a busy schedule for the maker community in the Kentuckiana area. Count’em....
In August we rolled out several updates with our continued support of industry standards, updated our homepage to feature Silicon-to-Silicon content and made a highly requested update to our product detail pages to show pricing and distributor stock. Here are the major updates to...
One Up Studio is a hardware design engineering provider with a focus on signal integrity, and not coincidentally, a Samtec customer. I caught up with Paul Monar, the owner, to pick his brain about some interesting design challenges he faces at One Up and his connector system sele...
Small footprints. Less weight. Signal integrity over longer distances. Scalability. Upgradeability. These and other factors are driving the adoption of optical engines in embedded computing. Annapolis Micro Systems, a leading FPGA board and systems supplier, and Samtec have colla...
View Full Site