triangle alert This site uses cookies and other website monitoring technologies to assist with website functions and with our promotional and marketing efforts. By clicking Accept, you consent to the terms in our recently updated Privacy Notice and Policy Manual.
Accept Decline
triangle alert This site uses cookies and other website monitoring technologies to assist with website functions and with our promotional and marketing efforts. By clicking Accept, you consent to the terms in our recently updated Privacy Notice and Policy Manual.
Accept Decline

Mezzanine Systems for Next Gen Speeds

Samtec helps address the challenges of next generation data rate requirements with industry-leading interconnect expertise, along with full system optimization services and support, including a vast library of development platforms and evaluation kits for high-performance interconnect systems. Samtec’s expanding line of proven High-Speed Mezzanine solutions engineered for 28 / 56 Gbps speeds includes extreme density arrays and ultra-high-density strips, along with optional mating cable systems.

Overview

NovaRay™ 56 Gbps NRZ Arrays

NovaRay™ Extreme Density Arrays are optimized for the demands of 56 Gbps systems and beyond, with a roadmap to 112 Gbps PAM4. Attributes include low crosstalk, tight impedance control and industry-leading data rates and density. Cable systems are also available.

Extreme Density Arrays & Cables

AcceleRate® HD 56 Gbps Strips

AcceleRate® HD Ultra-High-Density, Multi-Row Strips are incredibly dense with up to 240 total I/Os, a slim 5 mm width, and a low 5 mm stack height. Edge Rate® contacts are optimized for signal integrity and enable support of 56 Gbps PAM4 (28 Gbps NRZ) applications.

Ultra-High-Density Multi-Row Strips on 0.635 mm Pitch

SEARAY™ High-Density Arrays

SEARAY™ Open-Pin-Field Arrays enable maximum grounding and routing flexibility; Low Profile & Ultra High-Density designs are also available. SEARAY™ VITA 57.1 FMC / VITA 57.4 FMC+ connectors are engineered to aid in application development.

Open-Pin-Field Arrays, VITA 57.1 FMC & VITA 57.4 FMC+

Development Platforms

Microsemi® PolarFire™ Evaluation Kit

Ideal for high-speed transceiver evaluation, 10 Gb Ethernet, IEEE1588, JESD204B, SyncE, SATA and more, the Microsemi® PolarFire™ Evaluation Kit leverages Samtec’s SEARAY™ VITA 57.1 FMC connectors. Features include:

  • Connections via a High Pin Count (HPC) FPGA Mezzanine Card (FMC), numerous SMAs, PCIe®, Dual Gigabit Ethernet RJ45, SFP+ and USB
  • Mating connectors for the mezzanine card include ASP-134488-01 for 10 mm stack and ASP-134602-01 for 8.50 mm stack

View additional details at: samtec.com/fmc.

Microsemi® PolarFire™ Evaluation Kit

FMC / FMC+ Development Kits & Boards

Samtec offers a variety of development kits and boards featuring SEARAY™ VITA 57.1 FMC and VITA 57.4 FMC+ connectors that are designed to help simplify design and reduce time to market.

View details and additional kits at samtec.com/fmc or samtec.com/fmc-plus.

FMC / FMC+ Development Kits & Boards

SI Evaluation Kits

Samtec Signal Integrity Evaluation Kits help simplify the design process and reduce time to market. Kits are available for many of our high-performance connector sets and standard high-speed cable assembly configurations. Custom kits are also available.

View details at samtec.com/kits or contact kitsandboards@samtec.com for the current list of available kits.

SI Evaluation Kits

Families

NovaRay™NovaRay ™ 112 Gbps PAM4, Extreme Density Arrays

NovaRay™ combines extreme density and performance for 112 Gbps PAM4 per channel in 40% less space than traditional arrays.

Features
  • 112 Gbps PAM4 per channel
  • 4.0 Tbps aggregate data rate - 9 IEEE 400G channels
  • Innovative, fully shielded differential pair design enables extremely low crosstalk (to 40 GHz) and tight impedance control
  • 112 differential pairs per square inch
  • Two points of contact ensure a more reliable connection
  • 92 Ω solution addresses both 85 Ω and 100 Ω applications
Series
V
  • NVAM
  • NVAF
  • NVAC
  • NVAM-C
NovaRay™

AcceleRate® HDAcceleRate® HD Ultra-Dense Multi-Row Mezzanine Strips

These 0.635 mm pitch high-density multi-row mezzanine strips feature up to 240 high-speed Edge Rate® contacts in a slim, low-profile design.

Features
  • Incredibly dense with up to 240 total I/Os
  • Low profile 5 mm stack height
  • Slim 5 mm width
  • 4-row design; 10 - 60 positions per row (40 - 240 total positions)
  • Edge Rate® contact system optimized for signal integrity performance
  • Supports 56 Gbps PAM4 (28 Gbps NRZ) applications
  • Solder ball technology for simplified processing and self aligning
  • Additional stack heights and higher pin counts in development
Series
V
  • ADM6
  • ADF6
AcceleRate® HD

SEARAY™SEARAY™ High-Density Open-Pin-Field Arrays

These high-speed, high-density open-pin-field arrays allow maximum grounding and routing flexibility.

Features
  • Maximum routing and grounding flexibility
  • Lower insertion/extraction forces vs. typical array products
  • Performance up to 18 GHz/pair
  • Up to 500 I/Os in open pin field design
  • 1.27 mm (.050") pitch and space saving 0.80 mm pitch
  • Rugged Edge Rate® contact system
  • Can be "zippered" during mating/unmating
  • Solder charge terminations for ease of processing
  • Meets Extended Life Product™ (E.L.P.™) standards
  • 7 - 17 mm stack heights
  • Vertical, right-angle, press-fit
  • Elevated systems to 40 mm
  • 85 ohm systems
  • VITA 47, VITA 57, Pismo 2 certified
  • IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products (SEAM/SEAF series only)
  • IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products (SEAM/SEAF series only)
Series
V
  • SEAF
  • SEAM
  • SEAF-RA
  • SEAM-RA
  • SEAMP
  • SEAFP
  • SEAFP-RA
  • SEAR
  • SEAMI
  • JSO
SEARAY™

LP Array™LP Array™ Low Profile Open-Pin-Field High-Density Array

These low profile open-pin-field arrays feature as low as a 4 mm stack height and up to 320 total I/Os.

Features
  • 4 mm, 4.5 mm, 5 mm stack heights
  • Up to 320 I/Os
  • 4, 6 and 8 row designs
  • .050" (1.27 mm) pitch
  • Dual beam contact system
  • Solder crimp termination for ease of processing
  • Performance up to 18.5 GHz / 37 Gbps
Series
V
  • JSO
  • LPAF
  • LPAM
LP Array™

Fellow Samtec blogger David Pike recently asked the question, “Is Copper Dead?” He eloquently answers the question that copper and optical solutions still have long runways of growth. One group driving interest in optics is the Consortium for On-Board Optics (COBO). They are focu...
The top level of product categories on Samtec.com feature our Connectors, Cables, Optics, and RF pages, which give users a jumpoff point into the four main categories of products that Samtec sells. These pages were first released in 2016 with a very simple approach, to get the us...
In 1995, I attended a seminar in which the presenter told us that copper was dead.  This sort of statement is not new. The connector market is filled with armchair pundits who predict the demise of everything from D-Subminiature connectors (which are very much alive and kicking) ...
The FPGA (or ACAP) universe gathered at the San Jose Fairmount last week during the Xilinx Developer Forum. Engineers, data scientists, analysts, distributors, alliance partners and more came to learn about the latest hardware, software and system level solutions from Xilinx. Xil...
Samtec recently held its first annual Samtec Cares Day, where we welcomed dozens of local non-profits to our headquarters in New Albany, Indiana. The Samtec Cares Grant Program was created to positively impact and assist organizations within the communities in which Samtec associ...