Mezzanine Systems for Next Gen Speeds
Samtec helps address the challenges of next generation data rate requirements with industry-leading interconnect expertise, along with full system optimization services and support, including a vast library of development platforms and evaluation kits for high-performance interconnect systems. Samtec’s expanding line of proven High-Speed Mezzanine solutions engineered for 28 / 56 Gbps speeds includes extreme density arrays and ultra-high-density strips, along with optional mating cable systems.
Overview
NovaRay® 56 Gbps NRZ Arrays
NovaRay® Extreme Density Arrays are optimized for the demands of 56 Gbps systems and beyond, with a roadmap to 112 Gbps PAM4. Attributes include low crosstalk, tight impedance control and industry-leading data rates and density. Cable systems are also available.
AcceleRate® HD 56 Gbps Strips
AcceleRate® HD Ultra-High-Density, Multi-Row Strips are incredibly dense with up to 240 total I/Os, a slim 5 mm width, and a low 5 mm stack height. Edge Rate® contacts are optimized for signal integrity and enable support of 56 Gbps PAM4 (28 Gbps NRZ) applications.
SEARAY™ High-Density Arrays
SEARAY™ Open-Pin-Field Arrays enable maximum grounding and routing flexibility; Low Profile & Ultra High-Density designs are also available. SEARAY™ VITA 57.1 FMC / VITA 57.4 FMC+ connectors are engineered to aid in application development.
Development Platforms
Microsemi® PolarFire™ Evaluation Kit
Ideal for high-speed transceiver evaluation, 10 Gb Ethernet, IEEE1588, JESD204B, SyncE, SATA and more, the Microsemi® PolarFire™ Evaluation Kit leverages Samtec’s SEARAY™ VITA 57.1 FMC connectors. Features include:
- Connections via a High Pin Count (HPC) FPGA Mezzanine Card (FMC), numerous SMAs, PCIe®, Dual Gigabit Ethernet RJ45, SFP+ and USB
- Mating connectors for the mezzanine card include ASP-134488-01 for 10 mm stack and ASP-134602-01 for 8.50 mm stack
View additional details at: samtec.com/fmc.
FMC / FMC+ Development Kits & Boards
Samtec offers a variety of development kits and boards featuring SEARAY™ VITA 57.1 FMC and VITA 57.4 FMC+ connectors that are designed to help simplify design and reduce time to market.
View details and additional kits at samtec.com/fmc or samtec.com/fmc-plus.
SI Evaluation Kits
Samtec Signal Integrity Evaluation Kits help simplify the design process and reduce time to market. Kits are available for many of our high-performance connector sets and standard high-speed cable assembly configurations. Custom kits are also available.
View details at samtec.com/kits or contact kitsandboards@samtec.com for the current list of available kits.
Families
NovaRay®NovaRay® 112 Gbps PAM4, Extreme Density Arrays
NovaRay® combines extreme density and performance for 112 Gbps PAM4 per channel in 40% less space than traditional arrays.
Features
- 112 Gbps PAM4 per channel
- 4.0 Tbps aggregate data rate - 9 IEEE 400G channels
- Innovative, fully shielded differential pair design enables extremely low crosstalk (to 40 GHz) and tight impedance control
- 112 differential pairs per square inch
- Two points of contact ensure a more reliable connection
- 92 Ω solution addresses both 85 Ω and 100 Ω applications
AcceleRate® HDAcceleRate® HD Ultra-Dense Multi-Row Mezzanine Strips
These 0.635 mm pitch high-density multi-row mezzanine strips feature up to 240 high-speed Edge Rate® contacts in a slim, low-profile design.
Features
- Incredibly dense with up to 240 total I/Os; up to 400 I/Os in development
- Low profile 5 mm stack height
- Slim 5 mm width
- 4-row design; 10 - 60 positions per row (40 - 240 total positions)
- Edge Rate® contact system optimized for signal integrity performance
- Supports 56 Gbps PAM4 (28 Gbps NRZ) applications
- Solder ball technology for simplified processing and self aligning
- Additional stack heights in development
SEARAY™SEARAY™ High-Density Open-Pin-Field Arrays
These high-speed, high-density open-pin-field arrays allow maximum grounding and routing flexibility.
Features
- Maximum routing and grounding flexibility
- Lower insertion/extraction forces vs. typical array products
- 56 Gbps PAM4 performance
- Up to 560 I/Os in open pin field design
- 1.27 mm (.050") pitch
- Rugged Edge Rate® contact system
- Can be "zippered" during mating/unmating
- Solder charge terminations for ease of processing
- Meets Extended Life Product™ (E.L.P.™) standards
- 7 - 18.5 mm stack heights
- Vertical, right-angle, press-fit
- Elevated systems to 40 mm
- 85 ohm systems
- Standards: VITA 47, VITA 57.1 FMC, VITA 57.4 FMC+, VITA 74 VNX, PISMO™ 2
- IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products (SEAM/SEAF series only)
- IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products (SEAM/SEAF series only)
LP Array™LP Array™ Low Profile Open-Pin-Field High-Density Array
These low profile open-pin-field arrays feature as low as a 4 mm stack height and up to 400 total I/Os.
Features
- 4 mm, 4.5 mm, 5 mm stack heights
- Up to 400 I/Os
- 4, 6 and 8 row designs
- .050" (1.27 mm) pitch
- Dual beam contact system
- Solder crimp termination for ease of processing
- 28 Gbps NRZ/56 Gbps PAM4 performance
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