SEARAY™ High-Density Open Pin Field Arrays

SEAF

.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket

Features

• Up to 500 I/Os
• .050" (1.27 mm) pitch
• Rugged Edge Rate® contact
• Lower insertion/withdrawal forces
• Solder charge termination
• 7 mm - 17.5 mm stack heights
• Dual sourced by Molex®
• Samtec 28+ Gbps Solution
• IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products
• IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products

SEAM

.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Terminal

Features

• Up to 500 I/Os
• .050" (1.27 mm) pitch
• Rugged Edge Rate® contact
• Lower insertion/withdrawal forces
• Solder charge termination
• Dual sourced by Molex®
• 7 mm - 17.5 mm stack heights
• Samtec 28+ Gbps Solution
• IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products
• IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products

SEAF-RA

.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket, Right-Angle

Features

• High-density open-pin-field array
• Right-angle design
• .050" (1.27 mm) pitch
• Rugged Edge Rate® contact
• Lower insertion/withdrawal forces
• Solder charge termination
• Guide post, latching post options

SEAM-RA

.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Terminal, Right-Angle

Features

• High-density open-pin-field array
• Right-angle design
• .050" (1.27 mm) pitch
• Rugged Edge Rate® contact
• Lower insertion/withdrawal forces
• Solder charge terminations
• Guide post, latching post options

SEAMP

.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Terminal, Press-Fit

Features

• Press-fit
• High-density open-pin-field array
• Rugged Edge Rate® contact
• Lower insertion/withdrawal forces
• 7 mm, 8 mm and 8.5 mm stacks
• Termination: Press-fit

SEAFP

.050" SEARAY™ High-Speed Open-Pin-Field Array Socket, Press-Fit

Features

• High-density open-pin-field array
• Press-fit tails
• Rugged Edge Rate® contact
• Lower insertion/withdrawal forces
• 7 mm to 16 mm stack heights

SEAFP-RA

.050" SEARAY™ High-Speed Open-Pin-Field Array Socket, Right-Angle Press-Fit

Features

• High-density open-pin-field array
• Press-fit tails
• Rugged Edge Rate® contact
• Lower insertion/withdrawal forces
• Right-angle

SEAR

.050" SEARAY™ High-Speed High-Density Riser, 85 Ohm

Features

• SEARAY™ riser
• Up to 40.00 mm stack
• 85 ohm

SEAMI

.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Terminal, 85 Ohm

Features

• High-density open-pin-field array
• Samtec 28+ Gbps Solution
• 85 ohm tuned

JSO

Jack Screw Precision Board Stacking Standoff

Features

• Works as a traditional standoff
• Assists with unmating LSHM, SEAM/SEAF, SEAM8/SEAF8, LPAM/LPAF and other high-normal-force connectors
• Reduces risk for component damage on boards
• Board stacks from 4.00 mm to 16.00 mm
• Press-fit and threaded bases available

UBPS

1.50 mm SEARAY™ Socket Power Module

Features

UBPT

1.50 mm SEARAY™ Terminal Power Module

Features