triangle alert Samtec manufacturing capacity has been influenced by this pandemic. Our global operations team is working tirelessly to maximize output and minimize impact to customers while prioritizing COVID-19 critical response applications. Some part numbers are experiencing delays, but many are not. For the most up-to-date and accurate lead times use your My Samtec account, chat, or call us anytime for the latest information. ×
triangle alert Samtec manufacturing capacity has been influenced by this pandemic. Our global operations team is working tirelessly to maximize output and minimize impact to customers while prioritizing COVID-19 critical response applications. Some part numbers are experiencing delays, but many are not. For the most up-to-date and accurate lead times use your My Samtec account, chat, or call us anytime for the latest information. ×

SEARAY™ High-Density Open-Pin-Field Arrays

SEARAY™ High-Density Open-Pin-Field Arrays

These high speed, high density open-pin-field arrays allow maximum grounding and routing flexibility.


Family Overview

Searay Level 2

Samtec's SEARAY products are the industry's largest offering of high speed, high density open-pin-field arrays. They support 28+ Gbps applications and are also Final Inch® certified for Break Out Region trace routing recommendations to save designers time and money.

SEARAY Product Explorer

SEARAY explorer

Samtec's SEARAY™ products are the industry's largest offering of high speed, high density open-pin-field arrays. They support 28+ Gbps applications and are also Final Inch® certified for Break Out Region trace routing recommendations to save designers time and money.

FEATURES

Overview

SEARAY Video

Features

  • Maximum routing and grounding flexibility
  • Lower insertion/extraction forces vs. typical array products
  • Performance up to 28 Gbps NRZ/56 Gbps PAM4
  • Up to 560 I/Os in an open-pin-field design
  • 1.27 mm (.050") pitch and space saving 0.80 mm pitch
  • Rugged Edge Rate® contact system
  • Can be "zippered" during mating/unmating
  • Solder charge terminations for ease of processing
  • Meets Extended Life Product™ (E.L.P.™) standards
  • 7 - 40 mm stack heights
  • Vertical, right-angle, press-fit
  • 85 Ω systems
  • VITA 47, VITA 57, Pismo 2 certified
  • IPC J-STD-001F, Requirements for Soldered Electrical and Electronic Assemblies – Meets Class 3 Acceptability Criteria for High Performance/Harsh Environment
  • Electronic Products (SEAM/SEAF Series only)
  • IPC-A-610F, Acceptability of Electronic Assemblies – Meets Class 3 Acceptability Criteria for High Performance/Harsh Environment Electronic Products (SEAM/SEAF Series only)
SEARAY Open Pin Assignment

Features

SEARAY open-pin-field design gives customers the ability to simultaneously run differential pairs, single-ended signals and power though the same 28+ Gbps interconnect.

SEARAY Features

Technical Data

Mechanical
Overview

SEARAY Mechanical Overview

Protocols
Capable

SEARAY Protocols

Technical
Data

SEARAY Techdata

DOWNLOADS

Literature

SEARAY eBrochure

SEARAY eBrochure

Get
Micro Rugged Application Design Guide

Micro Rugged Application Design Guide

Get
Broadcast Video Solutions Guide

Broadcast Video Solutions Guide

Get
High-Speed Board-to-Board Application Guide

High-Speed Board-to-Board Application Guide

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Military/Aerospace Applications

Military/Aerospace Applications

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VIDEOS

SEARAY™ High Density Arrays

Samtec Advanced Interconnect Design Tech Center

Jack Screw Standoffs for High-Normal-Force Applications (JSO & JSOM)

Products

SEAF

.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket

Features
  • Up to 500 I/Os
  • .050" (1.27 mm) pitch
  • Rugged Edge Rate® contact
  • 56 Gbps PAM4 performance
  • Stack heights from 7 mm - 18.5 mm
  • Lower insertion/withdrawal forces
  • Solder charge termination
  • Dual sourced by Molex®
  • IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products
  • IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products
.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket

SEAM

.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Terminal

Features
  • Up to 500 I/Os
  • .050" (1.27 mm) pitch
  • Rugged Edge Rate® contact
  • 56 Gbps PAM4 performance
  • Lower insertion/withdrawal forces
  • Solder charge termination
  • Stack heights from 7 mm - 18.5 mm
  • Dual sourced by Molex®
  • IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products
  • IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products
.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Terminal

SEAF-RA

SEARAY™ High-Speed Right-Angled Open-Pin-Field Array Socket, .050" Pitch

Features
  • High-density open-pin-field array
  • Right-angle design
  • .050" (1.27 mm) pitch
  • Rugged Edge Rate® contact
  • Lower insertion/withdrawal forces
  • Solder charge termination
  • Guide post, latching post options
SEARAY™ High-Speed Right-Angled Open-Pin-Field Array Socket, .050" Pitch

SEAM-RA

.050" SEARAY™ High-Speed Right-Angled Open-Pin-Field Array Terminal

Features
  • High-density open-pin-field array
  • Right-angle design
  • .050" (1.27 mm) pitch
  • Rugged Edge Rate® contact
  • Lower insertion/withdrawal forces
  • Solder charge terminations
  • Guide post, latching post options
.050" SEARAY™ High-Speed Right-Angled Open-Pin-Field Array Terminal

SEAMP

.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Terminal, Press-Fit

Features
  • Termination: Press-fit
  • High-density open-pin-field array
  • Rugged Edge Rate® contact
  • 28 Gbps performance
  • Lower insertion/withdrawal forces
  • 7 mm, 8 mm, 8.5 mm and 9.5 mm stacks
.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Terminal, Press-Fit

SEAFP

.050" SEARAY™ High-Speed Open-Pin-Field Array Socket, Press-Fit

Features
  • High-density open-pin-field array
  • Press-fit tails
  • Rugged Edge Rate® contact
  • Lower insertion/withdrawal forces
  • 7 mm to 16 mm stack heights
.050" SEARAY™ High-Speed Open-Pin-Field Array Socket, Press-Fit

SEAFP-RA

.050" SEARAY™ High-Speed Open-Pin-Field Array Socket, Right-Angle Press-Fit

Features
  • High-density open-pin-field array
  • Press-fit tails
  • Rugged Edge Rate® contact
  • Lower insertion/withdrawal forces
  • Right-angle
.050" SEARAY™ High-Speed Open-Pin-Field Array Socket, Right-Angle Press-Fit

SEAR

.050" SEARAY™ High-Speed High-Density Riser, 85 Ohm

Features
  • SEARAY™ riser
  • Up to 40.00 mm stack
  • 85 ohm
.050" SEARAY™ High-Speed High-Density Riser, 85 Ohm

SEAMI

.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Terminal, 85 Ohm

Features
  • High-density open-pin-field array
  • 85 ohm tuned
  • Performance up to 14 Gbps
.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Terminal, 85 Ohm

JSO

Jack Screw Precision Board Stacking Standoff

Features
  • Works as a traditional standoff
  • Assists with unmating LSHM, SEAM/SEAF, SEAM8/SEAF8, LPAM/LPAF and other high-normal-force connectors
  • Reduces risk for component damage on boards
  • Board stacks from 4.00 mm to 16.00 mm
  • Press-fit and threaded bases available
Jack Screw Precision Board Stacking Standoff

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