Connectors
High-Speed Board-to-Board
High-Density Arrays
SEARAY™

SEARAY™ High-Density Open Pin Field Arrays

These high speed, high density open pin field arrays allow maximum grounding and routing flexibility.

FAMILY OVERVIEW

Searay Video

Samtec's SEARAY™ products are the industry's largest offering of high speed, high density open pin field arrays. They support 28+ Gbps applications and are also Final Inch® certified for Break Out Region trace routing recommendations to save designers time and money.

SEARAY™ Open Pin Field Arrays feature a .050" x .050" (1,27 mm x 1,27 mm) pitch grid for maximum grounding and routing flexibility. This system is available in stack heights from 7 mm to 40 mm with up to 500 Edge Rate® contacts. Vertical or right angle arrays (SEAM/SEAF Series) and a mating high speed cable assembly (SEAC Series) are available as 50Ω or 100Ω solutions. High retention press fit tails (SEAMP/SEAFP Series) and an 85Ω tuned interconnect (SEAMI Series) offer greater system flexibility. Elevated board stacking up to 40 mm is achieved by Samtec's high speed, high density riser (SEAR Series).

Samtec's SEARAY™ products are the industry's largest offering of high speed, high density open pin field arrays. They support 28+ Gbps applications and are also Final Inch® certified for Break Out Region trace routing recommendations to save designers time and money.

FEATURES

  • Maximum routing and grounding flexibility
  • Lower insertion/extraction forces vs. typical array products
  • Performance up to 18 GHz/pair
  • Up to 500 I/Os in open pin field design
  • 1.27 mm (.050") pitch and space saving 0.80 mm pitch
  • Rugged Edge Rate® contact system
  • Can be "zippered" during mating/unmating
  • Solder charge terminations for ease of processing
  • Meets Extended Life Product™ (E.L.P.™) standards
  • 7 - 17 mm stack heights
  • Vertical, right angle, press fit
  • 85Ω systems
  • VITA 47, VITA 57, Pismo 2 certified
  • IPC J-STD-001F, Requirements for Soldered Electrical and Electronic Assemblies – Meets Class 3 Acceptability Criteria for High Performance/Harsh Environment
  • Electronic Products (SEAM/SEAF Series only)
  • IPC-A-610F, Acceptability of Electronic Assemblies – Meets Class 3 Acceptability Criteria for High Performance/Harsh Environment Electronic Products (SEAM/SEAF Series only)
Searay Open Pin Assignment

SEARAY™ open pin field design gives customers the ability to simultaneously run differential pairs, single-ended signals and power though the same 28+ Gbps interconnect.

DOWNLOADS

Literature

Searay eBrochure

SEARAY™ eBrochure

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Micro Rugged Application Design Guide

Micro Rugged Application Design Guide

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Broadcast Video Solutions Guide

Broadcast Video Solutions Guide

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High-Speed Board-to-Board Application Guide

High-Speed Board-to-Board Application Guide

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Technical Documents

SERIES

JSO

Jack Screw Precision Board Stacking Standoff

Features
  • Works as a traditional standoff
  • Assists with unmating LSHM, SEAM/SEAF, SEAM8/SEAF8, LPAM/LPAF and other high-normal-force connectors
  • Reduces risk for component damage on boards
  • Board stacks from 4.00 mm to 16.00 mm
  • Press-fit and threaded bases available
Downloads
More Information
Jack Screw Precision Board Stacking Standoff

SEAF

.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket

Features
  • Up to 500 I/Os
  • .050" (1.27 mm) pitch
  • Rugged Edge Rate® contact
  • Lower insertion/withdrawal forces
  • Solder charge termination
  • 7 mm - 17.5 mm stack heights
  • Dual sourced by Molex®
  • Samtec 28+ Gbps Solution
  • IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products
  • IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products
Downloads
More Information
.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket

SEAFP

.050" SEARAY™ High-Speed Open-Pin-Field Array Socket, Press-Fit

Features
  • High-density open-pin-field array
  • Press-fit tails
  • Rugged Edge Rate® contact
  • Lower insertion/withdrawal forces
  • 7 mm to 16 mm stack heights
Downloads
More Information
.050" SEARAY™ High-Speed Open-Pin-Field Array Socket, Press-Fit

SEAFP-RA

.050" SEARAY™ High-Speed Open-Pin-Field Array Socket, Right-Angle Press-Fit

Features
  • High-density open-pin-field array
  • Press-fit tails
  • Rugged Edge Rate® contact
  • Lower insertion/withdrawal forces
  • Right-angle
Downloads
More Information
.050" SEARAY™ High-Speed Open-Pin-Field Array Socket, Right-Angle Press-Fit

SEAF-RA

.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket, Right-Angle

Features
  • High-density open-pin-field array
  • Right-angle design
  • .050" (1.27 mm) pitch
  • Rugged Edge Rate® contact
  • Lower insertion/withdrawal forces
  • Solder charge termination
  • Guide post, latching post options
Downloads
More Information
.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket, Right-Angle

SEAM

.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Terminal

Features
  • Up to 500 I/Os
  • .050" (1.27 mm) pitch
  • Rugged Edge Rate® contact
  • Lower insertion/withdrawal forces
  • Solder charge termination
  • Dual sourced by Molex®
  • 7 mm - 17.5 mm stack heights
  • Samtec 28+ Gbps Solution
  • IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products
  • IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products
Downloads
More Information
.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Terminal

SEAMI

.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Terminal, 85 Ohm

Features
  • High-density open-pin-field array
  • Samtec 28+ Gbps Solution
  • 85 ohm tuned
Downloads
More Information
.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Terminal, 85 Ohm

SEAMP

.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Terminal, Press-Fit

Features
  • Press-fit
  • High-density open-pin-field array
  • Rugged Edge Rate® contact
  • Lower insertion/withdrawal forces
  • 7 mm, 8 mm and 8.5 mm stacks
  • Termination: Press-fit
Downloads
More Information
.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Terminal, Press-Fit

SEAM-RA

.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Terminal, Right-Angle

Features
  • High-density open-pin-field array
  • Right-angle design
  • .050" (1.27 mm) pitch
  • Rugged Edge Rate® contact
  • Lower insertion/withdrawal forces
  • Solder charge terminations
  • Guide post, latching post options
Downloads
More Information
.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Terminal, Right-Angle

SEAR

.050" SEARAY™ High-Speed High-Density Riser, 85 Ohm

Features
  • SEARAY™ riser
  • Up to 40.00 mm stack
  • 85 ohm
Downloads
More Information
.050" SEARAY™ High-Speed High-Density Riser, 85 Ohm

UBPS

1.50 mm SEARAY™ Socket Power Module

Features
Downloads
More Information
1.50 mm SEARAY™ Socket Power Module

UBPT

1.50 mm SEARAY™ Terminal Power Module

Features
Downloads
More Information
1.50 mm SEARAY™ Terminal Power Module

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