Low Profile One-Piece Compression Arrays

High-speed low profile one-piece compression arrays with body height as low as 1.27 mm and dual or single compression contacts.

FEATURES

  • 1.27 mm and 2 mm standard body heights
  • 1.00 mm pitch
  • Dual compression or single compression with solder balls
  • 100 – 400 total pins
  • Ideal for low cost board stacking, module-to-board and LGA interfaces
  • Minimizes thermal expansion issues

SERIES

GMI

1.00 mm Low Profile One-Piece Array

Features
  • Dual compression or single compression with solder balls
  • Up to 400 I/Os
  • Low profile - 1.27 mm and 2 mm standard heights
1.00 mm Low Profile One-Piece Array

In December, we wrapped up a number of new features to Samtec.com to round out the 2018 year, including a new way to find Samtec sales locations and distributors, a new homepage panel for our Micro Rugged products, continued mobile optimizations, and a few updates to our Industry...
112 Gbps Samtec Flyover™ Demo Samtec’s Ralph Page walks us through a live demonstration of a Samtec Flyover™ system which enables 112 Gbps PAM4 performance. The Credo CDR generates two ports of 31-bit PRBS data at 112 Gbps PAM4 data rates. The signal travels from the Credo Pelica...
Since Samtec began in 1976, free connector samples have been a cornerstone of our business model. That said, we’re always looking for ways to continue to improve how we get samples into your hands. Recently we rolled out a simplified way to place sample requests on the website, w...
It was hot, really hot. In fact, things were getting so bad the walls around us were starting to melt, and just like that it was over; we failed current carrying capacity. That is Current Carrying Capacity (CCC) in a nutshell, well it would be if the parts were failing. Samtec pe...
In this video from SC18, Jignesh Shah of Samtec’s High Speed Connectivity Group walks us through a demonstration of a rearchitected Open Compute Project (OCP) wedge switch. By rearchitected we mean it utilizes Samtec Flyover™ high-speed cable assemblies to achieve next gen speeds...