High-speed low profile one-piece compression arrays with body height as low as 1.27 mm and dual or single compression contacts.

FEATURES

  • 1.27 mm standard body height
  • 1.00 mm pitch
  • Dual compression or single compression with solder balls
  • 100 – 300 total pins
  • Ideal for low cost board stacking, module-to-board and LGA interfaces
  • Minimizes thermal expansion issues

VIDEOS

Samtec Advanced Interconnect Design Tech Center

Products

GMI

1.00 mm Low Profile Compression Interposer

Features
  • Dual compression contacts
  • Up to 300 I/Os
  • Low profile - 1.27 mm standard height
1.00 mm Low Profile Compression Interposer

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