SEARAY™ High-Speed Cable Assemblies
These high-speed, high-density array cable assemblies feature micro coax cable and rugged Edge Rate® contacts.
SEAF-RA
.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket, Right-Angle
Features
- High-density open-pin-field array
- Right-angle design
- .050" (1.27 mm) pitch
- Rugged Edge Rate® contact
- Lower insertion/withdrawal forces
- Solder charge termination
- Guide post, latching post options
SEAF
.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket
Features
- Up to 500 I/Os
- .050" (1.27 mm) pitch
- Rugged Edge Rate® contact
- 56 Gbps PAM4 performance
- Stack heights from 7 mm - 18.5 mm
- Lower insertion/withdrawal forces
- Solder charge termination
- Dual sourced by Molex®
- IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products
- IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products
SEAC
.050" SEARAY™ High-Speed High-Density Array Cable Assembly
Features
- .050" (1.27 mm) pitch
- 50 ohm single-ended signal routing
- Mates with Edge Rate® sockets
- Designed for high-speed, micro pitch applications
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