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These high-speed, high-density array cable assemblies feature micro coax cable and rugged Edge Rate® contacts.

FEATURES

  • Performance up to 14 Gbps
  • Edge Rate® contacts reduce broadside coupling
  • Positive latching system
  • Terminal end options
  • Designed for rugged micro pitch applications
  • 36 AWG coax high-speed cable
  • 50 ohm single-ended signal routing

VIDEOS

Samtec Cable Group Tech Center HD

SEARAY™ High Density Arrays

SERIES

SEAF-RA

.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket, Right-Angle

Features
  • High-density open-pin-field array
  • Right-angle design
  • .050" (1.27 mm) pitch
  • Rugged Edge Rate® contact
  • Lower insertion/withdrawal forces
  • Solder charge termination
  • Guide post, latching post options
.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket, Right-Angle

SEAF

.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket

Features
  • Up to 500 I/Os
  • .050" (1.27 mm) pitch
  • Rugged Edge Rate® contact
  • 56 Gbps PAM4 performance
  • Stack heights from 7 mm - 18.5 mm
  • Lower insertion/withdrawal forces
  • Solder charge termination
  • Dual sourced by Molex®
  • IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products
  • IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products
.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket

SEAC

.050" SEARAY™ High-Speed High-Density Array Cable Assembly

Features
  • .050" (1.27 mm) pitch
  • 50 ohm single-ended signal routing
  • Mates with Edge Rate® sockets
  • Designed for high-speed, micro pitch applications
.050" SEARAY™ High-Speed High-Density Array Cable Assembly

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