High-Density Arrays

High-Density Arrays
Extreme Performance • Open-Pin-Field • Low-Profile

Samtec high-density array connectors feature a variety of pitches, stack heights, and configurations for maximum routing, grounding, and design flexibility.

Variety of Options

  • Pitch: 0.635 mm, 0.80 mm, 1.27 mm
  • Pin/Pair Count: 8 to 500; 1,000+ Roadmap
  • Stack Height: 4 mm to 40 mm
  • Options: Right-angle, press-fit tails, 85 Ω tuned, standoffs
Brand/Series Pitch Stack Height Pin Count
NovaRay®
NVAM/NVAF
0.80 mm x 1.80 mm 7 & 10 mm 8, 12, 16, 24, 32 pairs
AcceleRate® HP
APM6/APF6
0.635 mm 5 & 10 mm 80, 240, 400
AcceleRate® HD
ADM6/ADF6
0.635 mm 5 mm 40-400
SEARAY
SEAM/SEAF
1.27 mm x 1.27 mm 7-18.5 mm 40-560
SEARAY 0.80 mm
SEAM8/SEAF8
0.80 mm 7 & 10 mm 40-500
LP Array
LPAM/LPAF
1.27 mm x 1.27 mm 4, 4.5, 5 mm 40-400
High-Density Arrays Brochure

High-Density Arrays Brochure

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NovaRay®NovaRay® 112 Gbps PAM4, Extreme Density Arrays

NovaRay® combines extreme density and performance for 112 Gbps PAM4 per channel in 40% less space than traditional arrays.

Features
  • 112 Gbps PAM4 per channel
  • 4.0 Tbps aggregate data rate - 9 IEEE 400G channels
  • Innovative, fully shielded differential pair design enables extremely low crosstalk (to 40 GHz) and tight impedance control
  • 112 differential pairs per square inch
  • Two points of contact ensure a more reliable connection
  • 92 Ω solution addresses both 85 Ω and 100 Ω applications
Products
V
  • NVAM
  • NVAF
  • GPSO
  • NVAC
  • NVAM-C
NovaRay®

AcceleRate® HP High-Performance ArraysAcceleRate® HP High-Performance Arrays

AcceleRate® HP 0.635 mm pitch arrays feature 112 Gbps PAM4 extreme performance and a flexible open-pin-field design.

Features
  • 0.635 mm pitch open-pin-field array
  • 56 Gbps NRZ/112 Gbps PAM4 performance
  • Cost optimized solution
  • Low-profile 5 mm and up to 10 mm stack heights
  • Up to 400 total pins available; roadmap to 1,000+ pins
  • Data rate compatible with PCIe® 5.0 and 100 GbE
Products
V
  • APM6
  • APF6
  • GPSO
AcceleRate® HP High-Performance Arrays

AcceleRate® HDAcceleRate® HD Ultra-Dense Multi-Row Mezzanine Strips

These 0.635 mm pitch high-density multi-row mezzanine strips are rated for 56 Gbps PAM4 and feature up to 240 high-speed Edge Rate® contacts in a slim, low-profile design.

Features
  • Incredibly dense with up to 240 total I/Os; up to 400 I/Os in development
  • Low profile 5 mm stack height
  • Slim 5 mm width
  • 4-row design; 10 - 60 positions per row (40 - 240 total positions)
  • Edge Rate® contact system optimized for signal integrity performance
  • Supports 56 Gbps PAM4 (28 Gbps NRZ) applications
  • Solder ball technology for simplified processing and self aligning
  • Additional stack heights in development
Products
V
  • ADM6
  • ADF6
  • GPSO
AcceleRate® HD

SEARAY™SEARAY™ High-Density Open-Pin-Field Arrays

These high-speed, high-density open-pin-field arrays allow maximum grounding and routing flexibility.

Features
  • Maximum routing and grounding flexibility
  • Lower insertion/extraction forces vs. typical array products
  • 56 Gbps PAM4 performance
  • Up to 560 I/Os in open pin field design
  • 1.27 mm (.050") pitch
  • Rugged Edge Rate® contact system
  • Can be "zippered" during mating/unmating
  • Solder charge terminations for ease of processing
  • Meets Extended Life Product™ (E.L.P.™) standards
  • 7 - 18.5 mm stack heights
  • Vertical, right-angle, press-fit
  • Elevated systems to 40 mm
  • 85 ohm systems
  • Standards: VITA 47, VITA 57.1 FMC, VITA 57.4 FMC+, VITA 74 VNX, PISMO™ 2
  • IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products (SEAM/SEAF series only)
  • IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products (SEAM/SEAF series only)
Products
V
  • SEAF
  • SEAM
  • SEAF-RA
  • SEAM-RA
  • SEAMP
  • SEAFP
  • SEAFP-RA
  • SEAR
  • SEAMI
  • JSO
  • GPPK
  • GPSK
SEARAY™
features

SEARAY™ 0.80 mmSEARAY™ 0.80 mm Pitch Ultra High-Density Arrays

These ultra high-density, high-speed open pin field arrays feature a 0.80 mm pitch for up to 50% board space savings.

Features
  • 0.80 mm (.0315") pitch grid
  • 50% board space savings versus .050" (1.27 mm) pitch arrays
  • 28 Gbps NRZ/56 Gbps PAM4 performance
  • Rugged Edge Rate® contact system
  • Up to 500 I/Os
  • 7 mm and 10 mm stack heights
  • Solder charge terminations for ease of processing
  • Final Inch® certified for Break Out Region trace routing recommendations
Products
V
  • SEAM8
  • SEAF8
  • SEAF8-RA
  • JSO
SEARAY™ 0.80 mm

LP Array™LP Array™ Low Profile Open-Pin-Field High-Density Array

These low profile open-pin-field arrays feature as low as a 4 mm stack height and up to 400 total I/Os.

Features
  • 4 mm, 4.5 mm, 5 mm stack heights
  • Up to 400 I/Os
  • 4, 6 and 8 row designs
  • .050" (1.27 mm) pitch
  • Dual beam contact system
  • Solder crimp termination for ease of processing
  • 28 Gbps NRZ/56 Gbps PAM4 performance
Products
V
  • JSO
  • LPAF
  • LPAM
LP Array™

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