SEARAY™ High-Density Open-Pin-Field Arrays
SEARAY™ High-Density Open-Pin-Field Arrays
FAMILY OVERVIEW
Samtec's SEARAY™ products are the industry's largest offering of high speed, high density open-pin-field arrays. They support 28+ Gbps applications and are also Final Inch® certified for Break Out Region trace routing recommendations to save designers time and money.
Samtec's SEARAY™ products are the industry's largest offering of high speed, high density open-pin-field arrays. They support 28+ Gbps applications and are also Final Inch® certified for Break Out Region trace routing recommendations to save designers time and money.
FEATURES
- Maximum routing and grounding flexibility
- Lower insertion/extraction forces vs. typical array products
- Performance up to 28 Gbps NRZ/56 Gbps PAM4
- Up to 560 I/Os in an open-pin-field design
- 1.27 mm (.050") pitch and space saving 0.80 mm pitch
- Rugged Edge Rate® contact system
- Can be "zippered" during mating/unmating
- Solder charge terminations for ease of processing
- Meets Extended Life Product™ (E.L.P.™) standards
- 7 - 40 mm stack heights
- Vertical, right-angle, press-fit
- 85 Ω systems
- VITA 47, VITA 57, Pismo 2 certified
- IPC J-STD-001F, Requirements for Soldered Electrical and Electronic Assemblies – Meets Class 3 Acceptability Criteria for High Performance/Harsh Environment
- Electronic Products (SEAM/SEAF Series only)
- IPC-A-610F, Acceptability of Electronic Assemblies – Meets Class 3 Acceptability Criteria for High Performance/Harsh Environment Electronic Products (SEAM/SEAF Series only)
SEARAY™ open-pin-field design gives customers the ability to simultaneously run differential pairs, single-ended signals and power though the same 28+ Gbps interconnect.
SEAF
.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket
Features
- Up to 500 I/Os
- .050" (1.27 mm) pitch
- Rugged Edge Rate® contact
- 56 Gbps PAM4 performance
- Stack heights from 7 mm - 18.5 mm
- Lower insertion/withdrawal forces
- Solder charge termination
- Dual sourced by Molex®
- IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products
- IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products
SEAM
.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Terminal
Features
- Up to 500 I/Os
- .050" (1.27 mm) pitch
- Rugged Edge Rate® contact
- 56 Gbps PAM4 performance
- Lower insertion/withdrawal forces
- Solder charge termination
- Stack heights from 7 mm - 18.5 mm
- Dual sourced by Molex®
- IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products
- IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products
SEAF-RA
.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket, Right-Angle
Features
- High-density open-pin-field array
- Right-angle design
- .050" (1.27 mm) pitch
- Rugged Edge Rate® contact
- Lower insertion/withdrawal forces
- Solder charge termination
- Guide post, latching post options
SEAM-RA
.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Terminal, Right-Angle
Features
- High-density open-pin-field array
- Right-angle design
- .050" (1.27 mm) pitch
- Rugged Edge Rate® contact
- Lower insertion/withdrawal forces
- Solder charge terminations
- Guide post, latching post options
SEAMP
.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Terminal, Press-Fit
Features
- Termination: Press-fit
- High-density open-pin-field array
- Rugged Edge Rate® contact
- 28 Gbps performance
- Lower insertion/withdrawal forces
- 7 mm, 8 mm, 8.5 mm and 9.5 mm stacks
SEAFP
.050" SEARAY™ High-Speed Open-Pin-Field Array Socket, Press-Fit
Features
- High-density open-pin-field array
- Press-fit tails
- Rugged Edge Rate® contact
- Lower insertion/withdrawal forces
- 7 mm to 16 mm stack heights
SEAFP-RA
.050" SEARAY™ High-Speed Open-Pin-Field Array Socket, Right-Angle Press-Fit
Features
- High-density open-pin-field array
- Press-fit tails
- Rugged Edge Rate® contact
- Lower insertion/withdrawal forces
- Right-angle
SEAR
.050" SEARAY™ High-Speed High-Density Riser, 85 Ohm
Features
- SEARAY™ riser
- Up to 40.00 mm stack
- 85 ohm
SEAMI
.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Terminal, 85 Ohm
Features
- High-density open-pin-field array
- 85 ohm tuned
- Performance up to 14 Gbps
JSO
Jack Screw Precision Board Stacking Standoff
Features
- Works as a traditional standoff
- Assists with unmating LSHM, SEAM/SEAF, SEAM8/SEAF8, LPAM/LPAF and other high-normal-force connectors
- Reduces risk for component damage on boards
- Board stacks from 4.00 mm to 16.00 mm
- Press-fit and threaded bases available
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