高度隔离

面向板对板和电缆到板应用的成本节约型高性能射频方案。


板对板射频连接器板对板射频连接器

Samtec提供堆叠高度从4.22 mm (.166") 到10 mm (.394")的射频板对板连接器。解决方案包括高密度多位置模块、用于轴向和径向浮动式盲插或偏差应用的SMPM/SMP以及高度隔离低成本系统。

特色
  • 节省空间的设计:高密度、小尺寸
  • 联动、多位置SMPM模块,高达65 GHz
  • 迷你推拉连接器,带子弹型适配器
  • 联动微型插孔/插头,5 mm (.1969") 间距
  • IsoRate®高度隔离系统,成本只有传统机械加工射频连接器的一半
产品
V
  • GPPC
  • GPPB
  • PRFIA
  • SMPM-ST-TH
  • SMP-TH
  • SMP-B
  • IJ5
  • IP5
  • GRF1-J
  • GRF1-P
  • GRF7-J
  • GRF7-P
板对板射频连接器

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